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Method of making a semiconductive signal translating device

Assignee: Motors Liquidation Co
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Filing: 1973-05-03
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Granted: 1974-02-19
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Expires: 1993-05-03
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Abstract

Abstract An improved substrate material for semiconductor devices and methods for making same. The substrate includes a refractory like supporting layer coated with a high purity layer of reactively sputtered insulating material onto which a very high purity semiconductive layer is deposited. One device proposed for this substrate material is a diode assembly having an alumina substrate with a reactively sputtered layer of alumina on a major surface. A layer of P-type semiconductive material deposited on the sputtered layer and a P-N junction established in the layer.

Inventors

  • 👤 Kinnon M Mc
  • 👤 B Maciver

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 15:20
CPC Classifications
H; H10; H10D; H10D8/00; H10D8/411; Y; Y10; Y10S; Y10S148/00; Y10S148/007; Y10S148/025; Y10S148/15; Y10S148/158; Y10S438/00; Y10S438/967

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 170 words
A method for making a semiconductive signal translating device which comprises: preparing a major surface of an alumina substrate wafer to receive a high purity layer of insulating material; reactively sputtering a high purity coating of alumina to a thickness of at least about 1,000 angstroms onto said major surface to provide an extremely pure composite substrate on which to deposit even thin layers of a semiconductor; depositing a layer of a semiconductor selected from the group consisting of germanium and silicon onto said coating of alumina, said semiconductor layer being of one conductivity type; diffusing at leAst one impurity of opposite conductivity type into said semiconductor layer to form a P-N junction which intersects an exposed surface of said semiconductor layer between two areas of opposite conductivity type; attaching ohmic contacts to each of said areas of opposite conductivity type; enclosing said substrate, said areas and said ohmic contacts; and attaching terminal leads to said ohmic contacts for low resistance electrical connection of external circuitry to said enclosed areas.
Claim 2
Independent Claim 170 words
A method for making a semiconductive signal translating device which comprises: preparing a major surface of an alumina substrate wafer to receive a high purity layer of insulating material; reactively sputtering a high purity coating of alumina to a thickness of at least about 1,000 angstroms onto said major surface to provide an extremely pure composite substrate on which to deposit even thin layers of a semiconductor; depositing a layer of a semiconductor selected from the group consisting of germanium and silicon onto said coating of alumina, said semiconductor layer being of one conductivity type; diffusing at leAst one impurity of opposite conductivity type into said semiconductor layer to form a P-N junction which intersects an exposed surface of said semiconductor layer between two areas of opposite conductivity type; attaching ohmic contacts to each of said areas of opposite conductivity type; enclosing said substrate, said areas and said ohmic contacts; and attaching terminal leads to said ohmic contacts for low resistance electrical connection of external circuitry to said enclosed areas.

References Cited (Backward Citations)

US3072832A Cited
US3431637A Cited
US3395091A Cited
US3416224A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-02-18 1977-08-20 1978-02-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-02-18 1981-08-20 1982-02-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-02-18 1985-08-20 1986-02-19 $7700.00 Window Closed / Lapsed

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