Patent US4761101A successfully refreshed from Google Patents.
Patent US3789248A successfully refreshed from Google Patents.
US3789248A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Holder member for a semiconductor element
Assignee: Individual
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Filing: 1972-07-18
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Granted: 1974-01-29
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Expires: 1992-07-18
Abstract
Abstract A holder for a semiconductor element includes a pair of spaced support plates each resiliently biased against one of a pair of pressure plates which are located between the support plates. The semiconductor element is held between the pressure plates. The contacting surfaces of the support plates and the pressure plates each has a different radius of curvature. Various embodiments of the contacting surfaces of the support plates and the pressure plates include a convexly shaped projection on one with a convex, concave or planar surface on the other. Further, the contacting surfaces can be provided by an intermediate member positioned between the oppositely facing plates and with the intermediate member having a convex or spherically shaped contacting surface. The contacting surfaces are arranged for transforming a part of the kinetic energy developed under dynamic mechanical stress into frictional heat, such as by providing at least one of the contacting surfaces with a coefficient of friction between 0.025 and 0.3. In a preferred embodiment at least one of the contacting surfaces is provided with a coating of titanium carbide.
Inventors
- 👤 A Jaecklin
- 👤 O Scharli
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 22:31
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; H10W40/625
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
164 words
A holder device for holding at least one semiconductor element, comprises a pair of pressure plates arranged in oppositely disposed spaced relationship for holding at least one semiconductor element between them, clamping means including spring means for biasing said pressure plates against the semiconductor element from both sides, said clamping means and pressure plates forming a pair of contacting surfaces on each side of said semiconductor element and each pair of contacting surfaces at the location of contact having different radii of curvature, wherein the improvement comprises means forming said contacting surfaces for transforming a part of the kinetic energy developed under dynamic mechanical stress into frictional heat, at least one of the contacting surfaces of each said pair of contacting surfaces on each side of said semiconductor element having a coefficient of friction between 0.025 and 0.3, and at least one of the contacting surfaces of each pair of contacting surfaces on each side of said semiconductor element having a metallic carbide coating.
Claim 2
Dependent Claim
164 words
A holder device for holding at least one semiconductor element, comprises a pair of pressure plates arranged in oppositely disposed spaced relationship for holding at least one semiconductor element between them, clamping means including spring means for biasing said pressure plates against the semiconductor element from both sides, said clamping means and pressure plates forming a pair of contacting surfaces on each side of said semiconductor element and each pair of contacting surfaces at the location of contact having different radii of curvature, wherein the improvement comprises means forming said contacting surfaces for transforming a part of the kinetic energy developed under dynamic mechanical stress into frictional heat, at least one of the contacting surfaces of each said pair of contacting surfaces on each side of said semiconductor element having a coefficient of friction between 0.025 and 0.3, and at least one of the contacting surfaces of each pair of contacting surfaces on each side of said semiconductor element having a metallic carbide coating.
Claim 3
Dependent Claim
160 words
A holder device for holding at least one semiconductor element, comprises a pair of pressure plates arranged in oppositely disposed spaced relationship for holding at least one semiconductor element between them, clamping means including spring means for biasing said pressure plates against the semiconductor element from both sides, said clamping means and said pressure plates forming a pair of contacting surfaces on each side of said semiconductor element and each pair of contacting surfaces at the location of contact having different radii of curvature, wherein the improvement comprises means forming said contacting surfaces for transforming a part of the kinetic energy developed under dynamic mechanical stress into frictional heat, at least one of the contacting surfaces of each said pair of contacting surfaces on each side of said semiconductor element having a coefficient of friction between 0.025 and 0.3, and at least one of the contacting surfaces is provided by an arcuately-shaped intermediate piece having having a carbide metal coating.
Claim 4
Dependent Claim
160 words
A holder device for holding at least one semiconductor element, comprises a pair of pressure plates arranged in oppositely disposed spaced relationship for holding at least one semiconductor element between them, clamping means including spring means for biasing said pressure plates against the semiconductor element from both sides, said clamping means and said pressure plates forming a pair of contacting surfaces on each side of said semiconductor element and each pair of contacting surfaces at the location of contact having different radii of curvature, wherein the improvement comprises means forming said contacting surfaces for transforming a part of the kinetic energy developed under dynamic mechanical stress into frictional heat, at least one of the contacting surfaces of each said pair of contacting surfaces on each side of said semiconductor element having a coefficient of friction between 0.025 and 0.3, and at least one of the contacting surfaces is provided by an arcuately-shaped intermediate piece having having a carbide metal coating.
Claim 5
Dependent Claim
28 words
A holder device, as set forth in claim 1, wherein said metallic carbide coating has a thickness in the range of 1 Mu m to 100 Mu m.
Claim 6
Dependent Claim
29 words
A holder device, as set forth in claim 3, wherein the thickness of the metallic carbide coating is in the range of 5 Mu m to 30 Mu m.
Claim 7
Dependent Claim
19 words
A holder device, as set forth in claim 3, wherein the metallic carbide coating is formed of titanium carbide.
Claim 8
Dependent Claim
23 words
A holder device, as set forth in claim 2, wherein the metallic carbide coating on said intermediate piece is formed of titanium carbide.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-01-28 | 1977-07-30 | 1978-01-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-01-28 | 1981-07-30 | 1982-01-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-01-28 | 1985-07-30 | 1986-01-29 | $7700.00 | Window Closed / Lapsed |