Patent US3786444A successfully refreshed from Google Patents.
US3786444A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Magnetic thin film memory packaging design
Assignee: United States Department of the Army
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Filing: 1971-08-27
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Granted: 1974-01-15
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Expires: 1991-08-27
Abstract
Abstract A memory store unit is made by aligning film core areas and bonding them in pairs on either side of a single piece printed wire overlay. Top and bottom insulators are aligned and tacked to a backup board. An adhesive coated top ground plane is applied to the top insulator and the glass substrates. An adhesive epoxy cover is applied to the top ground plane. The top and bottom magnetic shields are applied to the cover and backup board, and the entire package is then subjected to compression and heat to adhere the laminations together into a flat dense package.
Inventors
- 👤 L Sly
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 18:22
CPC Classifications
G; G11; G11C; G11C5/00; G11C5/02; G11C5/04; G11C11/00; G11C11/02; G11C11/06
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
148 words
A memory packet assembly comprising a circuit overlay; film core arrays sandwiching said circuit overlay and aligning therewith; said film core arrays being deposited on glass substrates; top and bottom insulator each having apertures to receive the glass substrates of the film core arrays; said top and bottom insulators sandwiching the film core arrays; a laminated backup board having a top layer which serves as a bottom ground plane; a top ground plane means; said backup board and the top ground plane means sandwiching the top and bottom insulators; two shields sandwiching the top ground plane means and the backup board; said packet assembly is bonded together into a flat, dense package; ground pins connected through the assembly so as to electrically connect the top ground plane means with the bottom ground plane; and wherein the circuit overlay consists of printed wiring for word and common sense/digit lines.
Claim 2
Dependent Claim
148 words
A memory packet assembly comprising a circuit overlay; film core arrays sandwiching said circuit overlay and aligning therewith; said film core arrays being deposited on glass substrates; top and bottom insulator each having apertures to receive the glass substrates of the film core arrays; said top and bottom insulators sandwiching the film core arrays; a laminated backup board having a top layer which serves as a bottom ground plane; a top ground plane means; said backup board and the top ground plane means sandwiching the top and bottom insulators; two shields sandwiching the top ground plane means and the backup board; said packet assembly is bonded together into a flat, dense package; ground pins connected through the assembly so as to electrically connect the top ground plane means with the bottom ground plane; and wherein the circuit overlay consists of printed wiring for word and common sense/digit lines.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-01-14 | 1977-07-16 | 1978-01-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-01-14 | 1981-07-16 | 1982-01-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-01-14 | 1985-07-16 | 1986-01-15 | $7700.00 | Window Closed / Lapsed |