Dual inline package handling tool

Abstract

Abstract This tool is especially designed for handling dual inline package components as in removal from sockets and circuit boards, where the terminals are solder connected. The salient feature of this tool is the provision of a pair of flat blades of elongated form, disposed in face-to-face abutting relationship so as to be operable between the thumb and forefinger of one hand, the blades being pivotally connected together at their upper ends and having finger grip surfaces on their outer sides at the lower end above outwardly projecting extensions that carry downwardly reaching vertical jaw portions between which the package to be handled fits, these jaw portions each having on the outer end a downwardly and inwardly extending hook to hook under the end terminals at diagonally opposite corners of the dual inline package, so that the component can be pulled out of the socket or circuit board when the leads are free. The hooks, by virtue of their having contact only with diagonally opposite corners of the component, cannot apply pressure on the center terminals that are close to the integrated circuit chip, and it is a simple matter to open and close the tool between the thumb and forefinger of one hand. In view of the smallness of the tool the operator always has a good view of the entire operation. One size tool will remove several sizes of dual inline packages; for example, the eight, 10, 14, 16, and 18 terminal types. The finger grips enable holding the component quite securely. Closely spaced dual inline packages can be operated upon easily.

Inventors

• 👤 L Lynch

Bibliographic Details