Carrier for integrated circuit packages

Claim 1

A carrier adapted to receive an inserted dual-in-line integrated circuit package having leads and a generally flat rigid body with rearwardly extending side surfaces, said carrier comprising a one-piece insulating housing including a front face, a cavity having a generally rectangular cross-section extending rearwardly from said face and sized to receive said package, a plurality of rearwardly extending walls forming said cavity with frontwardly disposed surfaces for receiving said leads in spaced relationship and rearwardly disposed supporting surfaces for rearwardly positioning said package in said cavities, and retention means for retaining said body in said cavity, said means including deflection means integrally hinged frontwardly on opposite first and second of said walls and rearwardly extending therefrom in elongated form to at least a position coplanar with said supporting surfaces and in spaced-apart relationship so as to be capable of deflection towards said oNe wall by the insertion of said body, said elongated form including a surface facing away from said one wall at an acute angle, said surface including finger-force releasable holding means arranged to engage one of said side surfaces of said body and including a plurality of rearwardly spaced-apart detents to accommodate bodies of differing rearwardly extending side surfaces.