Electronic hybrid package

Claim 1

An electronic package comprising: a preformed lead frame means having interconnects leading therfrom; electronic means connected to said lead frame, a body surrounding the interconnects of said lead frame means, said body being molded about said interconnects to form a peripheral wall about said frame and thereby support said lead frame with said electronic means within an area formed by said wall, said molded body having atleast one cavity spaced from and under said area for said lead frame, said wall and said cavity having exposed contacts of said interconnects on a surface of said wall and a surface within said cavity; a power supply means receivable within said cavity, said power supply means being connectable to said exposed contacts of said interconnects from said lead frame such that it may be easily installed and replaced from time to time, said power supply means providing power through said lead frame to said electronic means; and controllable means bonded to said peripheral wall of said molded body, said controllable means having circuit connections to said contacts on said peripheral wall whereby said controllable means is operable by said electronic means within the area defined by said wall to thereby with said wall and body provide a sealed housing for said electronic means.