US3783499A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device fabrication using magnetic carrier
Assignee: AT&T Inc
•
Filing: 1972-04-24
•
Granted: 1974-01-08
•
Expires: 1992-04-24
Abstract
Abstract A process is described in which a semiconductor slice containing an array of individual semiconductor devices is temporarily mounted on a magnetic carrier plate initially by adhesive means. Final processing, such as lapping or otherwise thinning the slice, is done and a film of magnetically responsive material is applied to the semiconductor slice. Alternatively such material may be included in the earlier metalization of the semiconductor devices. The slice is then treated to separate it into an array of individual devices and the adhesive is removed. The devices then remain in the original spaced array and orientation for electrical testing and assembly into apparatus. In such form the devices are suitable for transportation.
Inventors
- 👤 H Hughes
- 👤 M Wachs
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:34
CPC Classifications
H; H10; H10P; H10P50/00; H10W; H10W72/00; H10W72/01; H10W72/0198
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
101 words
In the fabrication and assembly of semi-conductor devices the steps of 1. mounting the semiconductor slice containing an array of individual semiconductor devices on a carrier plate by means of an adhesive, said carrier plate containing an array of permanent magnetic domains in a spaced-apart array corresponding to the array of individual devices in said slice, 2. providing each said semiconductor device with a film of magnetically responsive material, 3. treating said slice to remove material intervening said individual semiconductor device, and 4. removing said adhesive leaving said individual devices mounted on said carrier plate and held solely by magnetic force.
Claim 2
Dependent Claim
101 words
In the fabrication and assembly of semi-conductor devices the steps of 1. mounting the semiconductor slice containing an array of individual semiconductor devices on a carrier plate by means of an adhesive, said carrier plate containing an array of permanent magnetic domains in a spaced-apart array corresponding to the array of individual devices in said slice, 2. providing each said semiconductor device with a film of magnetically responsive material, 3. treating said slice to remove material intervening said individual semiconductor device, and 4. removing said adhesive leaving said individual devices mounted on said carrier plate and held solely by magnetic force.
Claim 3
Dependent Claim
12 words
providing each said semiconductor device with a film of magnetically responsive material,
Claim 4
Dependent Claim
12 words
providing each said semiconductor device with a film of magnetically responsive material,
Claim 5
Dependent Claim
31 words
The method in accordance with claim 1 in which said film of magnetically responsive material is applied during fabrication of said devices prior to mounting said slice on the carrier plate.
Claim 6
Dependent Claim
39 words
The method in accordance with claim 1 in which said film of magnetically responsive material is applied after said slice has been mounted on said carrier plate by application of said film to the back surface of said slice.
Claim 7
Dependent Claim
12 words
treating said slice to remove material intervening said individual semiconductor device, and
Claim 8
Dependent Claim
12 words
treating said slice to remove material intervening said individual semiconductor device, and
Claim 9
Dependent Claim
18 words
removing said adhesive leaving said individual devices mounted on said carrier plate and held solely by magnetic force.
Claim 10
Dependent Claim
18 words
removing said adhesive leaving said individual devices mounted on said carrier plate and held solely by magnetic force.
Claim 11
Dependent Claim
31 words
The method in accordance with claim 1 including the step of removing a layer of material from the back surface of said slice while it is mounted on said carrier plate.
Claim 12
Dependent Claim
27 words
The method in accordance with claim 1 which includes the step of electrically testing said individual devices following the step of removing material intervening said individual devices.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-01-07 | 1977-07-09 | 1978-01-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-01-07 | 1981-07-09 | 1982-01-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-01-07 | 1985-07-09 | 1986-01-08 | $7700.00 | Window Closed / Lapsed |