US3783348A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encapsulated semiconductor device assembly
Assignee: RCA Corp
•
Filing: 1972-10-30
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Granted: 1974-01-01
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Expires: 1992-10-30
Abstract
Abstract A semiconductor assembly is presented which uses an encapsulated semiconductor device with a substantially U-shaped contact ribbon bonded thereto. The contact ribbon has elbows which extend beyond the surface of the semiconductor device. Upon the application of direct, downward pressure at the ends of the contact ribbon, the downward pressure is transferred to and absorbed by the encapsulating material. This assembly allows for very short lead length to the semiconductor device while at the same time shielding the semiconductor device from direct pressure.
Inventors
- 👤 G Swartz
- 👤 R Chamberlain
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:13
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/941; H10W72/944; H10W80/00; H10W80/701; H10W80/743
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
73 words
A semiconductor assembly comprising: a. a base, b. a semiconductor device having an exposed contact surface mounted on said base, c. a contact ribbon bonded to said contact surface, d. an elbow in said contact wire overhanging said base, e. a pressure-absorbing contact at the terminus of said contact ribbon and substantially above said elbow, and f. an insulating material encapsulating said semiconductor device and said contact ribbon except for said pressureabsorbing contact.
Claim 2
Dependent Claim
73 words
A semiconductor assembly comprising: a. a base, b. a semiconductor device having an exposed contact surface mounted on said base, c. a contact ribbon bonded to said contact surface, d. an elbow in said contact wire overhanging said base, e. a pressure-absorbing contact at the terminus of said contact ribbon and substantially above said elbow, and f. an insulating material encapsulating said semiconductor device and said contact ribbon except for said pressureabsorbing contact.
Claim 3
Dependent Claim
33 words
The semiconductor assembly of claim 1 wherein said contact ribbon is substantially U-shaped and includes a pair of elbows each overhanging said base and a pressure-absorbing contact substantially above each of said elbows.
Claim 4
Dependent Claim
15 words
The semiconductor assembly of claim 1 wherein said insulating material comprises an insulating, resilient plastic.
Claim 5
Dependent Claim
14 words
The semiconductor assembly of claim 3 wherein said insulating, resilient plastic is a polyimide.
Claim 6
Dependent Claim
12 words
The semiconductor assembly of claim 1 wherein said base is electrically conductive.
Claim 7
Dependent Claim
13 words
The semiconductor assembly of claim 1 wherein said base is a heat sink.
Claim 8
Dependent Claim
33 words
The semiconductor assembly of claim 6 further comprising a substantially U-shaped contact ribbon having a pair of elbows each overhanging said heat sink and a pressure-absorbing contact substantially above each of said elbows.
Claim 9
Dependent Claim
25 words
The semiconductor assembly of claim 7 further comprising an insulating plastic material encapsulating said semiconductor device and said contact ribbon except for said pressure-absorbing contacts.
Claim 10
Dependent Claim
85 words
The semiconductor assembly of claim 1 wherein said contact ribbon extends beyond the contact surface of said semiconductor device and has a first pair of elbows overhanging said base formed in said contact ribbon and has a second pair of elbows formed in said contact ribbon substantially above said first pair of elbows and the same distance from said first pair of elbows, whereby a pair of pressure-absorbing contacts are formed, each of which is substantially parallel to said contact surface of said semiconductor device.
Claim 11
Dependent Claim
30 words
The semiconductor assembly of claim 9 comprising an insulating plastic material encapsulating said semiconductor device and said contact ribbon except for said second pair of elbows and said pressure-absorbing contact.
Claim 12
Dependent Claim
12 words
The semiconductor assembly of claim 10 wherein said base is electrically conductive.
Claim 13
Dependent Claim
13 words
The semiconductor assembly of claim 11 wherein said base is a heat sink.
References Cited (Backward Citations)
US2935665A
Cited
GB910979A
Cited
FR1266551A
Cited
US3274667A
Cited
US3295089A
Cited
US3320497A
Cited
US3550228A
Cited
US3614550A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-31 | 1977-07-02 | 1978-01-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-31 | 1981-07-02 | 1982-01-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-31 | 1985-07-02 | 1986-01-01 | $7700.00 | Window Closed / Lapsed |