US3779885A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus and method for cathode sputtering on the two sides of a metallic support having large dimensions
Assignee: Progil SARL
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Filing: 1971-06-15
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Granted: 1973-12-18
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Expires: 1991-06-15
Abstract
Abstract Apparatus and method for depositing thin layers by cathodic sputtering onto metallic supports wherein a rarefied gaseous enclosure is provided having an ionic bombardment stage and a cathodic sputtering stage with means for transferring the supports from the first stage to the second stage without cooling or admitting air, each stage acting simultaneously on both surfaces of the metal supports.
Inventors
- 👤 P Labedan
- 👤 R Masotti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 14:32
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/34; C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/35; H01M; H01M4/00; H01M4/86; H01M4/88; H01M4/8825; H01M4/8867; H01M4/8871; Y; Y02; Y02E; Y02E60/00; Y02E60/30; Y02E60/50
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
102 words
Apparatus for depositing thin metallic layers by cathodic sputtering onto a metallic substrate comprising a rarefied gaseous atmosphere chamber, said chamber comprising a first ionic bombardment zone, a second cathodic sputtering deposition zone, and a movable electrically-conductive carriage for said metallic substrate capable of holding said metallic substrate and transferring it from said first zone to said second zone, when in said first said carriage beIng connected as cathode to a high voltage source, when in said second zone said carriage being grounded as anode and is positioned between two cathodic elements providing cathodic sputtering on both sides of said metallic substrate.
Claim 2
Dependent Claim
74 words
A process for depositing a thin metallic layer by cathodic sputtering onto a metallic substrate in a rarefied gaseous atmosphere chamber, comprising conducting in a first stage an ionic bombardment onto both sides of said substrate, transferring said substrate within said chamber to a second stage without cooling or introduction of air, cathodic sputtering on both sides of said substrate to deposit said thin metallic layer thereon, and removing said substrate from said chamber.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-17 | 1977-06-18 | 1977-12-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-17 | 1981-06-18 | 1981-12-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-17 | 1985-06-18 | 1985-12-18 | $7700.00 | Window Closed / Lapsed |