US3775579A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for repairing printed circuits
Assignee: International Business Machines Corp
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Filing: 1972-05-30
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Granted: 1973-11-27
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Expires: 1992-05-30
Abstract
Abstract A method and apparatus for repairing an open or void in a printed circuit line on a printed circuit board wherein the board is positioned with the open underneath a bonding head and metallic ribbon material is positioned over the open, thermal compression bonded to the circuit line on one side of the open, cut to length, and then thermal compression bonded to the circuit line on the other side of the open.
Inventors
- 👤 A Burghart
- 👤 D Houser
- 👤 J Kieffer
- 👤 G Wallace
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 16:14
CPC Classifications
B; B23; B23K; B23K11/00; B23K11/002; B23K11/004; B23K11/0046; H; H05; H05K; H05K3/00; H05K3/22; H05K3/225; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/1028; H05K2203/00; H05K2203/02; H05K2203/0278; H05K2203/11; H05K2203/1115; H05K2203/17; H05K2203/173; H05K3/30; H05K3/32; H05K3/328; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49718
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
241 words
A semiautomatic method for repairing an open in a printed circuit line on a printed circuit board by thermal compression bonding comprising the steps of: clamping said circuit board to the surface of an adjustable x-y table; positioning said x-y table to place the circuit line on one side of said open in bonding position beneath bonding tips; feeding an amount of metallic ribbon material into position to bridge the open on said circuit line; causing said bonding tips to press against the ribbon and circuit line on said one side of the open; establishing a flow of current through said bonding tips and ribbon to bond the ribbon to the circuit line on said one side of the open; stopping said flow of current and removing said bonding tips from the ribbon and circuit line; cutting the ribbon material on the other side of the open; positioning the x-y table to place the circuit line and ribbon on the other side of said open in bonding position beneath the bonding tips; causing said bonding tips to press against the ribbon and circuit line on said other side of the open; establishing a second flow of current through said bonding tips and ribbon to bond the ribbon to the circuit line on said other side; stopping said second flow of current and removing said bonding tips from the ribbon and circuit line; and unclamping said circuit board from the x-y table.
Claim 2
Dependent Claim
241 words
A semiautomatic method for repairing an open in a printed circuit line on a printed circuit board by thermal compression bonding comprising the steps of: clamping said circuit board to the surface of an adjustable x-y table; positioning said x-y table to place the circuit line on one side of said open in bonding position beneath bonding tips; feeding an amount of metallic ribbon material into position to bridge the open on said circuit line; causing said bonding tips to press against the ribbon and circuit line on said one side of the open; establishing a flow of current through said bonding tips and ribbon to bond the ribbon to the circuit line on said one side of the open; stopping said flow of current and removing said bonding tips from the ribbon and circuit line; cutting the ribbon material on the other side of the open; positioning the x-y table to place the circuit line and ribbon on the other side of said open in bonding position beneath the bonding tips; causing said bonding tips to press against the ribbon and circuit line on said other side of the open; establishing a second flow of current through said bonding tips and ribbon to bond the ribbon to the circuit line on said other side; stopping said second flow of current and removing said bonding tips from the ribbon and circuit line; and unclamping said circuit board from the x-y table.
Claim 3
Dependent Claim
26 words
A method as in claim 1 wherein the initiation of said current flow is controlled by the pressure of the bonding tips against the circuit board.
Claim 4
Dependent Claim
23 words
A method as in claim 1 wherein the circuit board is clamped by moving the x-y table against the underside of the board.
Claim 5
Dependent Claim
45 words
A method as in claim 1 wherein the ribbon is gripped and automatically slid into position to bridge the open and then automatically cut after the first bonding operation to leave an ungripped segment of ribbon which has one end bonded to the circuit line.
Claim 6
Dependent Claim
23 words
A method as in claim 1 wherein the x-y table is automatically adjusted to a center position prior to repairing another circuit line.
Claim 7
Independent Claim
227 words
An apparatus for repairing an open in a printed circuit line on a printed circuit board by thermal compression bonding comprising: an adjustable x-y table; means for clamping said circuit board to the surface of said x-y table; a bonding unit having bonding tips adapted to carry out a thermal compression bonding operation; means for positioning said x-y table to place the circuit line on one side of said open in position under said bonding tips for a first bonding operation and later to place the circuit line on the other side of said open in position under the bonding tips for a second bonding operation; a supply of metallic repair ribbon material; means for feeding an amount of said ribbon into position on said circuit line to bridge the open therein prior to the first bonding operation; means for cutting the ribbon on said other side of the open after the first bonding operation and prior to the second bonding operation; means for moving the bonding tips into pressure contact with the ribbon and circuit line for each bonding operation; and means responsive to a preset value of contact pressure of the bonding tips for controlling said bonding unit to establish a flow of current through said tips and ribbon whereby the ribbon segment bridging the open is bonded at each end to the circuit line.
Claim 8
Independent Claim
227 words
An apparatus for repairing an open in a printed circuit line on a printed circuit board by thermal compression bonding comprising: an adjustable x-y table; means for clamping said circuit board to the surface of said x-y table; a bonding unit having bonding tips adapted to carry out a thermal compression bonding operation; means for positioning said x-y table to place the circuit line on one side of said open in position under said bonding tips for a first bonding operation and later to place the circuit line on the other side of said open in position under the bonding tips for a second bonding operation; a supply of metallic repair ribbon material; means for feeding an amount of said ribbon into position on said circuit line to bridge the open therein prior to the first bonding operation; means for cutting the ribbon on said other side of the open after the first bonding operation and prior to the second bonding operation; means for moving the bonding tips into pressure contact with the ribbon and circuit line for each bonding operation; and means responsive to a preset value of contact pressure of the bonding tips for controlling said bonding unit to establish a flow of current through said tips and ribbon whereby the ribbon segment bridging the open is bonded at each end to the circuit line.
Claim 9
Dependent Claim
39 words
An apparatus as in claim 6 and including second means responsive to a second preset value of contact pressure of the bonding tips for affecting the movement of the bonding tips away and out of contact with said ribbon.
Claim 10
Dependent Claim
30 words
An apparatus as in claim 6 wherein said clamping means comprises a vertically fixed clamping member and means for moving said x-y table and circuit board up against said member.
Claim 11
Independent Claim
272 words
An apparatus for repAiring an open in a printed circuit line on a printed circuit board by thermal compression bonding comprising: an adjustable x-y table; means for clamping said circuit board to the surface of said x-y table; a bonding unit having bonding tips adapted to carry out a thermal compression bonding operation; means for positioning said x-y table to place the circuit line on one side of said open in position under said bonding tips for a first bonding operation and later to place the circuit line on the other side of said open in position under the bonding tips for a second bonding operation; a supply of metallic repair ribbon material; a gripper jaw and cutoff blade mechanism for receiving and gripping said ribbon; means for advancing said gripper jaw mechanism to slide an amount of said ribbon into position on said circuit line to bridge the open therein prior to the first bonding operation; means for retracting said gripper jaw mechanism and operating said cutoff blade after the first bonding operation and prior to the second bonding operation whereby the ribbon is cut on said other side of the open and the gripper jaw mechanism takes a new bite of ribbon from said supply; means for moving the bonding tips into pressure contact with the ribbon and circuit line for each bonding operation; and means responsive to a preset value of contact pressure of the bonding tips for controlling said bonding unit to establish a flow of current through said tips and ribbon whereby the ribbon segment bridging the open is bonded at each end to the circuit line.
Claim 12
Independent Claim
272 words
An apparatus for repAiring an open in a printed circuit line on a printed circuit board by thermal compression bonding comprising: an adjustable x-y table; means for clamping said circuit board to the surface of said x-y table; a bonding unit having bonding tips adapted to carry out a thermal compression bonding operation; means for positioning said x-y table to place the circuit line on one side of said open in position under said bonding tips for a first bonding operation and later to place the circuit line on the other side of said open in position under the bonding tips for a second bonding operation; a supply of metallic repair ribbon material; a gripper jaw and cutoff blade mechanism for receiving and gripping said ribbon; means for advancing said gripper jaw mechanism to slide an amount of said ribbon into position on said circuit line to bridge the open therein prior to the first bonding operation; means for retracting said gripper jaw mechanism and operating said cutoff blade after the first bonding operation and prior to the second bonding operation whereby the ribbon is cut on said other side of the open and the gripper jaw mechanism takes a new bite of ribbon from said supply; means for moving the bonding tips into pressure contact with the ribbon and circuit line for each bonding operation; and means responsive to a preset value of contact pressure of the bonding tips for controlling said bonding unit to establish a flow of current through said tips and ribbon whereby the ribbon segment bridging the open is bonded at each end to the circuit line.
Claim 13
Dependent Claim
54 words
An apparatus as in claim 9 wherein said last named means comprises a first pressure switch and a second pressure switch is provided which is responsive to a second preset value of contact pressure of the bonding tips for affecting the movement of the bonding tips away and out of contact with said ribbon.
Claim 14
Dependent Claim
21 words
An apparatus as in claim 10 wherein said second preset value of contact pressure is higher than said first preset value.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-11-26 | 1977-05-28 | 1977-11-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-11-26 | 1981-05-28 | 1981-11-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-11-26 | 1985-05-28 | 1985-11-27 | $7700.00 | Window Closed / Lapsed |