Method for the production of semiconductor thermoelements

Claim 1

A method of accurately assembling a bonded matrix of layers of coextensively disposed electrically conductive limbs to give precise final dimensions and limited voidage, said method comprising the steps: i. cutting strips of cured polyimide film to the same length as said limbs, some of said strips having widths equal to a single layer of said limbs and some of said strips having width equal to the thickness of said limbs, ii. individually coating the limbs in an uncured polyimide and placing each such coated limb in succession in rows and layers both separated by said strips of cured polyimide film, iii. slowly compressing all said limbs together after assembly to a precisely controlled size to expel excess uncured polyimide and maintaining compression, iv. wiping off excess uncured polyimide, v. baking the assembled limbs at a temperature between 60* and 100* C for at least 20 hours, vi. baking the assembled limbs at about 100* C for at least 1 hour, vii. baking the assembled limbs at about 150* C for at least 1 hour, viii. removing compression, and ix. baking at about 350* C for at least 1 hour.