US3774078A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermally integrated electronic assembly with tapered heat conductor
Assignee: Massachusetts Institute of Technology
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Filing: 1972-03-29
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Granted: 1973-11-20
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Expires: 1992-03-29
Abstract
Abstract Heat is conducted from electronic equipment through tapered thermal conductors.
Inventors
- 👤 J Martin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:45
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20509
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
109 words
An electronic assembly comprising an electronic package having heat dissipating electronics, a thermal sink, and a tapered thermal conductor having a larger end and a smaller end, one of said package and said sink being thermally connected to a tapered chamber, and the other being thermally connected to said thermal tapered conductor, said conductor being secured in said chamber with heat transfer between said package and said sink being across the interface between said conductor and said chamber, and a circuit board having means for electrically connecting it to said heat dissipating electronics, said tapered thermal conductor extending through an aperture in said circuit board into said tapered chamber.
Claim 2
Dependent Claim
109 words
An electronic assembly comprising an electronic package having heat dissipating electronics, a thermal sink, and a tapered thermal conductor having a larger end and a smaller end, one of said package and said sink being thermally connected to a tapered chamber, and the other being thermally connected to said thermal tapered conductor, said conductor being secured in said chamber with heat transfer between said package and said sink being across the interface between said conductor and said chamber, and a circuit board having means for electrically connecting it to said heat dissipating electronics, said tapered thermal conductor extending through an aperture in said circuit board into said tapered chamber.
Claim 3
Dependent Claim
16 words
The electronic assembly of claim 1 wherein said tapered chamber is formed in said thermal sink.
Claim 4
Dependent Claim
55 words
The electronic assembly of claim 1 wherein said heat-dissipating electronics comprises a plurality of heat-dissipating semiconductor circuits stacked and thermally interconnected, said circuits being connected to common electrical connectors, and said circuit board having means for receiving said common electrical connectors, the end circuit of said stack being thermally connected to said tapered thermal conductor.
Claim 5
Dependent Claim
67 words
The electronic assembly of claim 1 wherein said heat-dissipating electronics comprises a plurality of semiconductor circuits disposed on a plurality of wiring boards in thermal contact therewith, said wiring boards being stacked and thermally interconnected and having common electrical conductors, and said circuit board having means for receiving said common electrical connectors, and end wiring board of said stack being thermally connected to said tapered thermal conductor.
Claim 6
Dependent Claim
29 words
The electronic assembly of claim 3 wherein said semi-conductor circuits are LSI chips, a plurality of said chips being arranged on the planar surface of each said wiring board.
Claim 7
Dependent Claim
54 words
The electronic assembly of claim 3 including an intermediate planar thermal conductor located between said circuit board and said end wiring board and In thermal contact with said end wiring board along one planar surface, said tapered conductor being secured at its large end to the opposite planar surface of said intermediate thermal conductor.
Claim 8
Dependent Claim
16 words
The electronic assembly of claim 6, wherein said tapered thermal conductor has two opposed tapered sides.
Claim 9
Dependent Claim
45 words
The electronic assembly of claim 1 wherein said heat-dissipating electronics comprises a plurality of heat-producing semiconductor circuits, stacked and thermally interconnected, said circuits being connected to common electrical connectors, and said package includes mounting structure detachably connecting said common electrical connectors to said circuit board.
Claim 10
Dependent Claim
51 words
The electronic assembly of claim 8 wherein said mounting structure includes detachably connectable male and female connector members, each pair of said male and female connector members being arranged with one of said connector members electrically connected to a said common connector and the other electrically connected to said circuit board.
Claim 11
Dependent Claim
30 words
The electronic assembly of claim 1 wherein said thermal sink comprises a thermally conductive flexible hollow cooling tube confining a cooling fluid, said tapered chamber being formed in said package.
Claim 12
Dependent Claim
29 words
The electronic assembly of claim 10 wherein said cooling tube extends through the large tapered end of said tapered thermal conductor, said conductor being secured in said tapered chamber.
Claim 13
Dependent Claim
33 words
The electronic assembly of claim 11 wherein said package includes a thermally conductive housing containing a plurality of tapered chambers and a plurality of said tapered thermal conductors are secured in said chambers.
Claim 14
Dependent Claim
17 words
The electronic assembly of claim 11 wherein said tube includes stress relief bends between adjacent thermal conductors.
Claim 15
Dependent Claim
19 words
The electronic assembly of claim 11 comprising an intermediate thermal sink between said heat dissipating electronics and said housing.
Claim 16
Dependent Claim
68 words
The electronic assembly of claim 13 wherein said intermediate thermal sink has a tapered chamber, and said electronic package includes an intermediate tapered thermal conductor thermally connected to said heat-dissipating electronics, said conductor being secured in said chamber with heat transfer between said electronics and said intermediate thermal sink being across the interface of said tapered chamber of said intermediate thermal sink and said intermediate tapered thermal conductor.
Claim 17
Dependent Claim
56 words
The electronic assembly of claim 14 wherein said heat-dissipating electronics comprises a plurality of heat-producing semiconductor circuits stacked and thermally interconnected, said circuits being connected to common electrical connectors, and said circuit board having means for receiving said common electrical connectors, the end circuit of said stack being thermally connected to said intermediate tapered thermal conductor.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-11-19 | 1977-05-21 | 1977-11-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-11-19 | 1981-05-21 | 1981-11-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-11-19 | 1985-05-21 | 1985-11-20 | $7700.00 | Window Closed / Lapsed |