US3417458A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Production of electrical semiconductor device
Assignee: Siemens AG
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Filing: 1966-05-17
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Granted: 1968-12-24
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Expires: 1986-05-17
Abstract
No abstract record available.
Inventors
- 👤 Lob Udo
- 👤 Martin Heinz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 06:14
CPC Classifications
H; H10; H10P; H10P95/00; H10W; H10W99/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49826; Y10T29/49895; Y10T29/49901
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
148 words
THE METHOD OF PRODUCING ELECTRICAL SEMICONDUCTOR DEVICES HAVING AT LEAST ONE SIMICONDUCTOR MEMBER WITH CONTACT FACES AT ITS AXIALLY OPPOSITE SIDES AND HAVING TWO CONDUCTOR PLATES SOLDERED TO SAID RESPECTIVE FACES AND PROVIDED WITH HOLES UNIFORMLY DISTRIBUTED ABOUT SAID FACES, WHICH COMPRISES PLACING ONE OF SAID PLATES UPON A BASE HAVING AT LEAST THREE UPWARDLY PROTRUDING GUIDE PINS WITH SAID HOLES OF SAID PLATE PASSING OVER SAID RESPECTIVE PINS, STACKING A SOLDER LAYER AND THEREUPON SAID MEMBER ON TOP OF SAID ONE PLATE BETWEEN SAID PINS SO AS TO BE HELD LATERALLY IN POSITION BY SAID PINS, PLACING ANOTHER LAYER OF SOLDER AND ULTIMATELY THE OTHER PLATE ON TOP SO AS TO HAVE THE PINS PASS THROUGH THE HOLES IN SAID OTHER PLATE, HEATING THE ASSEMBLY TO SOLDERING TEMPERATURE SO AS TO JOIN SAID PLATES TO SAID CONTACT FACES, AND REMOVING THE RESULTING SEMICONDUCTOR DEVICE FROM THE PINS.
Claim 2
Independent Claim
148 words
THE METHOD OF PRODUCING ELECTRICAL SEMICONDUCTOR DEVICES HAVING AT LEAST ONE SIMICONDUCTOR MEMBER WITH CONTACT FACES AT ITS AXIALLY OPPOSITE SIDES AND HAVING TWO CONDUCTOR PLATES SOLDERED TO SAID RESPECTIVE FACES AND PROVIDED WITH HOLES UNIFORMLY DISTRIBUTED ABOUT SAID FACES, WHICH COMPRISES PLACING ONE OF SAID PLATES UPON A BASE HAVING AT LEAST THREE UPWARDLY PROTRUDING GUIDE PINS WITH SAID HOLES OF SAID PLATE PASSING OVER SAID RESPECTIVE PINS, STACKING A SOLDER LAYER AND THEREUPON SAID MEMBER ON TOP OF SAID ONE PLATE BETWEEN SAID PINS SO AS TO BE HELD LATERALLY IN POSITION BY SAID PINS, PLACING ANOTHER LAYER OF SOLDER AND ULTIMATELY THE OTHER PLATE ON TOP SO AS TO HAVE THE PINS PASS THROUGH THE HOLES IN SAID OTHER PLATE, HEATING THE ASSEMBLY TO SOLDERING TEMPERATURE SO AS TO JOIN SAID PLATES TO SAID CONTACT FACES, AND REMOVING THE RESULTING SEMICONDUCTOR DEVICE FROM THE PINS.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1971-12-24 | 1972-06-24 | 1972-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1975-12-24 | 1976-06-24 | 1976-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1979-12-24 | 1980-06-24 | 1980-12-24 | $7700.00 | Window Closed / Lapsed |