US3772764A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making enclosure for a semiconductor device
Assignee: Motors Liquidation Co
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Filing: 1973-04-06
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Granted: 1973-11-20
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Expires: 1993-04-06
Abstract
Abstract A hermetically sealed enclosure for a semiconductor device and a method and apparatus for making same is disclosed. A tubular ceramic housing is provided with an integral die on one end. A cold weldable layer is brazed on the integral die. A first cover member is brazed onto the other end providing a hermetic seal there. A second cover member is cold welded to the layer hermetically sealing the one end. The cold welding apparatus includes a pressure equalizing assembly having a pair of spaced resiliently coupled elements with facing hemispherical recesses. One of the elements slides on a bearing ball nested within the recesses to equalize the compressive forces of the cold welding around the end of the housing.
Inventors
- 👤 T Furnival
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 00:02
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0441; B; B23; B23K; B23K20/00; B23K20/02; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; H10W95/00
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
130 words
A method of fabricating an enclosure for a semiconductor device which comprises the steps of: providing a tubular ceramic housing having one end with an integral circumferential closed axially extending cold welding die, brazing a cold weldable layer to said one end witH at least a portion of said layer overlying said die throughout the entire circumference thereof, placing a cover member having a cold weldable rim on said housing with said rim being registered on said layer portion, supporting the other end of said housing on a pressure equalizing assembly, and compressing said rim and said layer portion on the integral die to form a continuous cold weld, said pressure equalizing assembly being operative to substantially equalize the compressive forces on said housing in order to prevent damage thereto.
Claim 2
Independent Claim
130 words
A method of fabricating an enclosure for a semiconductor device which comprises the steps of: providing a tubular ceramic housing having one end with an integral circumferential closed axially extending cold welding die, brazing a cold weldable layer to said one end witH at least a portion of said layer overlying said die throughout the entire circumference thereof, placing a cover member having a cold weldable rim on said housing with said rim being registered on said layer portion, supporting the other end of said housing on a pressure equalizing assembly, and compressing said rim and said layer portion on the integral die to form a continuous cold weld, said pressure equalizing assembly being operative to substantially equalize the compressive forces on said housing in order to prevent damage thereto.
Claim 3
Independent Claim
146 words
A method of fabricating an enclosure for a semiconductor device which comprises the steps of: providing a tubular ceramic housing having one end face with an integral closed circumferential projection providing a cold welding die, brazing a cold weldable layer around the entire circumference of said cold welding die, brazing a first cover member to the other end face of said housing to provide a hermetic end seal thereat, placing a cover member having a cold weldable rim on said housing with said rim being registered on said layer, coaxially supporting the opposite end face of said housing on a cold welding ring of a pressure equalizing assembly, and compressing said rim and said layer on the integral die to form a continuous cold weld, said pressure equalizing assembly being operative to substantially equalize the compressive forces on said housing in order to prevent damage thereto.
Claim 4
Independent Claim
146 words
A method of fabricating an enclosure for a semiconductor device which comprises the steps of: providing a tubular ceramic housing having one end face with an integral closed circumferential projection providing a cold welding die, brazing a cold weldable layer around the entire circumference of said cold welding die, brazing a first cover member to the other end face of said housing to provide a hermetic end seal thereat, placing a cover member having a cold weldable rim on said housing with said rim being registered on said layer, coaxially supporting the opposite end face of said housing on a cold welding ring of a pressure equalizing assembly, and compressing said rim and said layer on the integral die to form a continuous cold weld, said pressure equalizing assembly being operative to substantially equalize the compressive forces on said housing in order to prevent damage thereto.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-11-19 | 1977-05-21 | 1977-11-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-11-19 | 1981-05-21 | 1981-11-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-11-19 | 1985-05-21 | 1985-11-20 | $7700.00 | Window Closed / Lapsed |