Abstract In simultaneously bonding a plurality of leads extending from a multileaded device to associated bonding sites on a generally planar surface of a workpiece such as contact areas on a thinfilm circuit, difficulty is experienced (1) in compensating for lack of parallelism between the generally planar surface of the workpiece and a planar bonding surface of a bonding tool so as to apply substantially the same bonding pressure to each lead, and (2) in compensating for such lack of parallelism without permitting any substantial lateral displacement of the workpiece relative to the bonding tool which would either disturb the alignment of the leads relative to their associated bonding sites or damage the device and/or workpiece. A compensating base is disclosed having a platform for supporting a workpiece, and having a pivot mounted for lateral displacement for pivotally supporting the platform. A bonding tool is also disclosed having a recessed portion for receiving the multileaded device with each lead extending across a planar bonding surface of the bonding tool. As the bonding tool is displaced to bring the multileaded device into engagement with the workpiece, the workpiece is pivoted about the first point of contact to bring the workpiece into parallelism with the bonding tool so as to apply substantially the same bonding pressure to each lead to simultaneously bond the leads to their associated bonding sites. As the pivot which pivotally supports the platform is permitted lateral displacement, the workpiece pivots about the first point of contact with the bonding tool without any substantial lateral displacement of the workpiece relative to the bonding tool.
Inventors
👤 Robert Holbrook Cushman
Bibliographic Details
Application Number—
JurisdictionUS
Data Sourcegoogle_patents
Last Synchronized2026-11-03 17:19
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
111 words
A method for simultaneously bonding leads to a workpiece while compensating for lack of parallelism between the workpiece and a bonding surface of a bonding tool wherein the workpiece is mounted on a first pivot, comprising the steps of: displacing the bonding tool relative to a workpiece to bring a bonding surface of the bonding tool into engagement with the workpiece; and pivoting the workpiece and a bonding tool relative to each other about that portion of the bonding surface which first engages the workpiece while permitting lateral displacement of the first pivot to eliminate sliding of the workpiece across the bonding surface thereby simultaneously bonding the leads to the workpiece.
Claim 2
Independent Claim
111 words
A method for simultaneously bonding leads to a workpiece while compensating for lack of parallelism between the workpiece and a bonding surface of a bonding tool wherein the workpiece is mounted on a first pivot, comprising the steps of: displacing the bonding tool relative to a workpiece to bring a bonding surface of the bonding tool into engagement with the workpiece; and pivoting the workpiece and a bonding tool relative to each other about that portion of the bonding surface which first engages the workpiece while permitting lateral displacement of the first pivot to eliminate sliding of the workpiece across the bonding surface thereby simultaneously bonding the leads to the workpiece.
Claim 3
Independent Claim
99 words
A method for simultaneously bonding a plurality of leads to associated bonding sites on a generally planar surface of a workpiece, comprising the steps of: positioning the leads in registration with the associated bonding sites; and displacing a planar bonding surface into engagement with the leads to apply bonding forces to the leads while distributing the bonding forces equally over the leads to simultaneously bond the leads to the associated bonding sites by imparting relative movement to the workpiece and the planar bonding surface to bring the planar bonding surface and the planar surface of the workpiece into parallelism.
Claim 4
Independent Claim
99 words
A method for simultaneously bonding a plurality of leads to associated bonding sites on a generally planar surface of a workpiece, comprising the steps of: positioning the leads in registration with the associated bonding sites; and displacing a planar bonding surface into engagement with the leads to apply bonding forces to the leads while distributing the bonding forces equally over the leads to simultaneously bond the leads to the associated bonding sites by imparting relative movement to the workpiece and the planar bonding surface to bring the planar bonding surface and the planar surface of the workpiece into parallelism.