Patent US1416149A successfully refreshed from Google Patents.
Patent US3766308A successfully refreshed from Google Patents.
US3766308A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Joining conductive elements on microelectronic devices
Assignee: Microsystems International Ltd
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Filing: 1972-05-25
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Granted: 1973-10-16
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Expires: 1992-05-25
Abstract
Abstract The invention relates to a method of interconnecting adjacent conductors upon a support member, - particularly in a microelectronic device. The portions of the conductors to be connected are provided with nodules or pads of malleable metal which may be deformed and spread into one another to form a cold weld. The invention is particularly useful for the interconnection of conductive tracks on integrated circuit or similar devices.
Inventors
- 👤 A Loro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:11
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4685; H05K1/00; H05K1/02; H05K1/0286; H05K1/0293; H05K3/22; H05K3/225; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W20/491; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/641; H05K2203/00; H05K2203/01; H05K2203/0195; H05K2203/02; H05K2203/0278; H05K2203/17; H05K2203/173; H05K3/30; H05K3/32; H05K3/328; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
65 words
A method of forming a joint between a plurality of adjacent, spaced electrically conductive elements situated upon a support member, said method comprising the steps of forming upon at least the adjacent areas of said electrically conductive elements raised areas of malleable metal and applying pressure to said areas of malleable metal causing said areas to deform and spread into welding contact one with another.
Claim 2
Independent Claim
65 words
A method of forming a joint between a plurality of adjacent, spaced electrically conductive elements situated upon a support member, said method comprising the steps of forming upon at least the adjacent areas of said electrically conductive elements raised areas of malleable metal and applying pressure to said areas of malleable metal causing said areas to deform and spread into welding contact one with another.
Claim 3
Dependent Claim
25 words
The method of claim 1 wherein said adjacent, spaced electrically conductive elements are conductors deposited upon a substrate member forming part of a microelectronic device.
Claim 4
Dependent Claim
14 words
The method of claim 1 wherein said raised areas are pads of malleable metal.
Claim 5
Dependent Claim
14 words
The method of claim 1 wherein said raised areas are nodules of malleable metal.
Claim 6
Dependent Claim
24 words
The method of claim 4 wherein said nodules are of a metal selected from the group consisting of gold, silver, aluminum and tin/lead alloy.
Claim 7
Dependent Claim
24 words
The method of claim 4 wherein said nodules are of dissimilar metals selected from the group consisting of gold, silver, aluminum and tin/lead alloy.
Claim 8
Independent Claim
73 words
A method of forming a joint between a plurality of adjacent, spaced electrical conductors deposited upon a substrate surface and forming part of a microelectronic device, said method comprising the steps of forming at the adjacent areas of said conductors nodules of malleable metal and applying pressure to said nodules causing deformation thereof and spreading of the metal of each of said nodules into welding contact with the metal of the remaining nodules.
Claim 9
Independent Claim
73 words
A method of forming a joint between a plurality of adjacent, spaced electrical conductors deposited upon a substrate surface and forming part of a microelectronic device, said method comprising the steps of forming at the adjacent areas of said conductors nodules of malleable metal and applying pressure to said nodules causing deformation thereof and spreading of the metal of each of said nodules into welding contact with the metal of the remaining nodules.
Claim 10
Dependent Claim
13 words
The method of claim 7 wherein said microelectronic device is an integrated circuit.
Claim 11
Dependent Claim
47 words
The method of claim 7 which comprises applying pressure to said nodules as aforesaid by means of a bonding tool comprising a needle means having a substantially flat work-face, said work-face being forced into contact with said nodules in a direction substantially normal to said substrate surface.
Claim 12
Dependent Claim
49 words
The method of claim 7 which comprises applying pressure to said nodules as aforesaid by means of a bonding tool comprising a needle means having a substantially dished or concave work-face, said work-face being forced into contact with said nodules in a direction substantially normal to said substrate surface.
Claim 13
Dependent Claim
108 words
In a microelectronic device, a support member adapted to receive electrical components thereupon and conductive elements located upon said support member for interconnecting said electrical components, selected ones of said conductive elements having areas isolated from but lying in close proximity to adjacent corresponding areas of selected others of said conductive elements, each of said areas having a raised area of malleable metal located thereupon, the raised areas of malleable metal on corresponding areas being of such shape, volume and proximity to each other as to flow together and form a weld when a compressive force normal to the support member is simultaneously applied to said raised areas.
Claim 14
Dependent Claim
108 words
In a microelectronic device, a support member adapted to receive electrical components thereupon and conductive elements located upon said support member for interconnecting said electrical components, selected ones of said conductive elements having areas isolated from but lying in close proximity to adjacent corresponding areas of selected others of said conductive elements, each of said areas having a raised area of malleable metal located thereupon, the raised areas of malleable metal on corresponding areas being of such shape, volume and proximity to each other as to flow together and form a weld when a compressive force normal to the support member is simultaneously applied to said raised areas.
Claim 15
Dependent Claim
14 words
The structure of claim 11 wherein said raised areas are pads of malleable metal.
Claim 16
Dependent Claim
14 words
The structure of claim 11 wherein said raised areas are nodules of malleable metal.
Claim 17
Dependent Claim
24 words
The structure of claim 13 wherein said nodules are of a metal selected from the group consisting of gold, silver, aluminum and tin/lead alloy.
Claim 18
Dependent Claim
13 words
The structure of claim 11 wherein said microelectronic device is an integrated circuit.
Claim 19
Dependent Claim
95 words
In a microelectronic device, a support member adapted to receive electrical components thereupon and conductive elements located upon said support member for interconnecting said electrical components, selected ones of said conductive elements having areas isolated from and adjacent areas of selected other said conductive elements, each of said areas having a raised area of malleable metal located thereupon and the raised metal areas of each of one or more selected groups of adjacent conductor areas being deformed and spread into welding co-relationship with each said group in order to electrically interconnect said adjacent conductor areas.
Claim 20
Dependent Claim
95 words
In a microelectronic device, a support member adapted to receive electrical components thereupon and conductive elements located upon said support member for interconnecting said electrical components, selected ones of said conductive elements having areas isolated from and adjacent areas of selected other said conductive elements, each of said areas having a raised area of malleable metal located thereupon and the raised metal areas of each of one or more selected groups of adjacent conductor areas being deformed and spread into welding co-relationship with each said group in order to electrically interconnect said adjacent conductor areas.
Claim 21
Dependent Claim
14 words
The structure of claim 16 wherein said raised areas are pads of malleable metal.
Claim 22
Dependent Claim
14 words
The structure of claim 16 wherein said raised areas are nodules of malleable metal.
Claim 23
Dependent Claim
24 words
The structure of claim 18 wherein said nodules are of a metal selected from the group consisting of gold, silver, aluminum and tin/lead alloy.
Claim 24
Dependent Claim
24 words
The structure of claim 18 wherein said nodules are of dissimilar metals selected from the group consisting of gold, silver, aluminum and tin/lead alloy.
Claim 25
Dependent Claim
13 words
The structure of claim 16 wherein said microelectronic device is an integrated circuit.
References Cited (Backward Citations)
US2967979A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-15 | 1977-04-16 | 1977-10-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-15 | 1981-04-16 | 1981-10-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-15 | 1985-04-16 | 1985-10-16 | $7700.00 | Window Closed / Lapsed |