Abstract This invention relates to a method of increasing the spacing between the confronting side walls of adjacent semiconductor pellets constituting portions of a subdivided wafer of semiconductor material secured to a flexible substrate without disturbing the relative orientation which the portions had in the parent wafer before its subdivision. The substrate is bent to form grooves of tapered cross-section between the confronting side walls of the adjacent pellets. An etchant is then placed in the grooves so as to etch the exposed side walls of the pellets and thereby enlarge the cross-section of the grooves and the consequent spacing of the pellets, without disturbing the original relative orientation of the pellets.
The method defined in claim 1 wherein the wafer is secured to the support by an adhesive resilient wax.
Claim 2
Dependent Claim
15 words
The method defined in claim 1 wherein said wafer is refrigerated during the etching thereof.
Claim 3
Dependent Claim
17 words
The method defined in claim 1 where said subdividing is accomplished by scribing and breaking said wafer.
Claim 4
Dependent Claim
27 words
The method defined in claim 1 wherein said wafer is bent about an axis of curvature with which said grooves make an acute angle of about 45*.
Claim 5
Dependent Claim
33 words
The method defined in claim 1 wherein said grooves are enlarged sufficiently to have a minimum transverse dimension of at least 0.002 inch at the major face of said wafer adjacent said support.