Patent US3760142A successfully refreshed from Google Patents.
US3760142A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Soldering apparatus having a non-uniform heat transfer distribution
Assignee: AT&T Inc
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Filing: 1972-07-31
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Granted: 1973-09-18
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Expires: 1992-07-31
Abstract
Abstract Radiantly heated tools are used for bonding leads to an array of circuit paths. The heat transfer characteristics of the tools over their area of contact with the leads and circuit paths cause a profile or contour to be formed which matches the heat capacity profile or contour of the array to the heat output contour of a heat source. The heat transfer contour of the tools may be obtained by varying parameters such as material, mass, density, specific heat and absorptivity over the contact area of the tools.
Inventors
- 👤 D Schoenthaler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 13:30
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3494; B; B23; B23K; B23K1/00; B23K1/005; B23K1/0053; H05K2203/00; H05K2203/30; H05K2203/304; H05K3/36; H05K3/361; H05K3/363
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
79 words
An apparatus for heating an array of elements having a definite heat capacity distribution to a substantially uniform temperature, comprIsing: a heat source having a heat output of definite distribution; and means heated by said source for conducting heat to each element of the array wherein said means has a heat transfer distribution which matches the heat capacity distribution of the array to the heat output distribution of the source to thereby heat the array to a uniform temperature.
Claim 2
Independent Claim
79 words
An apparatus for heating an array of elements having a definite heat capacity distribution to a substantially uniform temperature, comprIsing: a heat source having a heat output of definite distribution; and means heated by said source for conducting heat to each element of the array wherein said means has a heat transfer distribution which matches the heat capacity distribution of the array to the heat output distribution of the source to thereby heat the array to a uniform temperature.
Claim 3
Dependent Claim
41 words
The apparatus of claim 1 wherein the heat transfer distribution of said heat conducting means is effected by a variation in at least one of the following properties of the heat conducting means: material, geometry, mass, density, specific heat and absorptivity.
Claim 4
Dependent Claim
14 words
The apparatus of claim 2 wherein the heat source output consists substantially of radiation.
Claim 5
Dependent Claim
11 words
The apparatus of claim 3 wherein the radiation is infrared radiation.
Claim 6
Dependent Claim
21 words
The apparatus of claim 1 wherein the heat conducting means has a recess therein in which the heat source is positioned.
Claim 7
Dependent Claim
38 words
The apparatus of claim 5 wherein the heat conducting means is abutted by a compliant member which is urged against the heat conducting means to insure uniform pressure by the contact surface against the elements to be bonded.
Claim 8
Dependent Claim
21 words
The apparatus of claim 1 further including means for moving the heat conducting means and heat source relative to one another.
Claim 9
Dependent Claim
95 words
Apparatus for bonding leads to locations on an array of solder coated circuit paths by reflowing solder coating the paths, comprising: a heat source having a heat output of definite distribution, means heated by said source for conducting heat to the locations at which the leads are to be bonded wherein said means has a heat transfer distribution which matches the heat capacity distribution of the array to the heat output distribution of the source to thereby heat the array to a predetermined temperature at the locations at which the leads are to be bonded.
Claim 10
Dependent Claim
95 words
Apparatus for bonding leads to locations on an array of solder coated circuit paths by reflowing solder coating the paths, comprising: a heat source having a heat output of definite distribution, means heated by said source for conducting heat to the locations at which the leads are to be bonded wherein said means has a heat transfer distribution which matches the heat capacity distribution of the array to the heat output distribution of the source to thereby heat the array to a predetermined temperature at the locations at which the leads are to be bonded.
Claim 11
Dependent Claim
35 words
The apparatus of claim 8 wherein the heat conducting means is a plate which varies in thickness according to the amount of heat needed to be transferred to match the heat capacity of the array.
Claim 12
Dependent Claim
26 words
The apparatus of claim 8 wherein the heat conducting means is an elongated tool having a recess extending therein in which the heat source is located.
Claim 13
Dependent Claim
13 words
The apparatus of claim 8 wherein the heat source is an infrared lamp.
Claim 14
Dependent Claim
84 words
In an apparatus for boding leads to various locations on an array of solder coated circuit paths having a non-uniform distribution of heat capacities by heating the locations momentarily to reflow the solder; a tool for conducting heat to the locations, said tool being segmented into sections, said sections having different heat transfer characteristics, and said heat transfer characteristics of said sections generally matching the heat capacity of the locations to which the sections correspond to thereby heat the locations to a uniform temperature.
Claim 15
Dependent Claim
84 words
In an apparatus for boding leads to various locations on an array of solder coated circuit paths having a non-uniform distribution of heat capacities by heating the locations momentarily to reflow the solder; a tool for conducting heat to the locations, said tool being segmented into sections, said sections having different heat transfer characteristics, and said heat transfer characteristics of said sections generally matching the heat capacity of the locations to which the sections correspond to thereby heat the locations to a uniform temperature.
Claim 16
Dependent Claim
36 words
The apparatus of claim 12 wherein different heat transfer characteristics are achieved in said sections by a variation among the sections at least one of the following properties: material, geometry, mass, density, specific heat and absorptivity.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-09-17 | 1977-03-19 | 1977-09-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-09-17 | 1981-03-19 | 1981-09-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-09-17 | 1985-03-19 | 1985-09-18 | $7700.00 | Window Closed / Lapsed |