Nvironments conformal coating process to improve package reliability in adverse e
Abstract
Abstract A CONFORMAL INSULATING COATING IS APPLIED TO THE HERMETIC PACKAGE HOUSING AN ELECTRONIC DEVICE USING A PROCESS THAT ELIMINATES THE COATING FROM THE TIPS OF THE ELECTRICAL CONNECTING LEADS. THE ENCAPSULATED DEVICE IS HEATED AND THEN IMMERSED INTO A FLUIDIZED BED CONTAINING SOLID GRANULES OF UNREACTED COATING MATERIAL. THE GRANULES STICK TO THE MAJOR PORTIONS OF THE PACKAGE BUT THE LEAD EXTREMITIES, BEING COOLER BECAUSE OF THEIR LOW THEMAL MADD AND REMOTENESS FROM THE BODY OF THE PACKAGE, COOL TO A TEMPERATURE TOO LOW TO PERMIT THE GRANULES TO STICK. UPON FIRING, THE ADHERING GRANULES MELT AND COALESCE PERMITTING A CHEMICAL REACTION TO TAKE PLACE AND COMPLETE THE COATING. THE RESULTANT COATING IMPROVES THE PACKAGE HERMETICITY AND GREATLY IMPROVES RESISTANCE TO ADVERSE AMBIENT ATMOSHERES. THE COATING IS APPLED WITHOUT THE MASKING NORMALLY REQUIRED TO PREVENT ITS APPLICATION TO UNWANTED AREAS ON THE CONNECTING LEADS.
Inventors
- 👤 R Scheetz
- 👤 S Sobota
Bibliographic Details
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