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Method for reducing interdiffusion rates between thin film components

Assignee: AT&T Inc
•
Filing: 1969-04-04
•
Granted: 1973-08-07
•
Expires: 1989-04-04
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Abstract

Abstract A method for reducing interdiffusion rates between thin film conductive components. The method comprises vacuum depositing the conductive films at a partial pressure of 10-70 nicrons in the presence of an inert gas (e.g., Argon).

Inventors

  • 👤 H Theuerer
  • 👤 P Turner

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 10:39
CPC Classifications
H; H01; H01B; H01B1/00; C; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/18; C23C14/22; C23C14/24; H10; H10N; H10N97/00

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 15 words
A method in accordance with claim 1 wherein one of said conductive components is gold.
Claim 2
Dependent Claim 15 words
A method in accordance with claim 2 wherein one of said conductive components is silver.
Claim 3
Dependent Claim 12 words
A method in accordance with claim 3 wherein said gas is argon.
Claim 4
Dependent Claim 12 words
A method in accordance with claim 3 wherein said gas is helium.

References Cited (Backward Citations)

US3028663A Cited
US3063858A Cited
US3402073A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-08-06 1977-02-05 1977-08-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-08-06 1981-02-05 1981-08-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-08-06 1985-02-05 1985-08-07 $7700.00 Window Closed / Lapsed

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