Encapsulated packaged electronic assembly

Abstract

Abstract AN IMPROVEMENT IN THE ECONOMY OF PACKAGING BY LOCKING OUT HARMFUL PARTICULATES BEFORE APPLICATON OF INSULATION PACKING AND SAVINGS IN REWORK OR REPAIR OF INSULATION PACKAGED AND ENCAPSULATED ELECTRICAL COMPONENTS, ASSEMBLIES OR CIRCUITRY. THE THREE COMPONENT PACKAGE STRUCTURE PROVIDED IS PREFABRICATED ELECTRONIC CIRCUITRY COMPONENTS STRUCTURE HAVING A CONFORMAL COATING OF RELATIVELY SOLVENT INSOLUBLE POLYMERS AS POLYMERS OF PARA-XYLYLENE MATERIAL OR RELATIVELY SOLVENT INSOLUBLE POLYMERS OF POLYPHENYLENE AND CURING AGENT INTERMEDIATE THE ELECTRONIC COMPONENTS AND A CONVENTIONALLY APPLIED RELATIVELY SOLVENT SOLUBLE COATING OF INSULATING RESIN MATERIAL OR CONVENTIONAL FOAM AS POLYURETHANE, EPOXY RESIN, AND THE LIKE POTTING MATERIAL APPLIED THEREOVER. IN ADDITION TO IMPROVING UPON THE INSULATION ENCAPSULATED PREFABRICATED ELECTRONIC CIRCUITRY BY REDUCING THE NUMBER OF DEFECTIVE ELECTRONIC UNIT MANUFACTURED, THIS IMPROVED PACKAGING ALSO IS OF ECONOMIC VALUE TO THE INDUSTRY BY ENABLING ECONOMIC CHEMICAL REMOVAL OF THE INSULATING FOAM OR POTTING COMPOUND AND REWORKING THE CIRCUITRY OR REPLACEMENT OF A DEFECTIVE CIRCUITRY COMPONENT. FURTHER, THE MULTIPLE COATINGS PROVIDE MORE ASSURANCE OF MAINTAINING RESONATE FREQUENCY AND AIDS IN IMPROVING VIBRATION AND SHOCK RESISTANCE.

Inventors

• 👤 H Tittle

Bibliographic Details