Patent US3745648A successfully refreshed from Google Patents.
US3745648A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for mounting semiconductor components
Assignee: Siemens AG
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Filing: 1970-03-18
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Granted: 1973-07-17
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Expires: 1990-03-18
Abstract
Abstract Method of connecting an integrated circuit with outside electrical leads. The integrated circuit is inserted into an insulating substrate upon which electrical conductance paths are located. An electrical connection is established between the conductor paths on the substrate and the integrated circuit. A hole is etched into the substrate so that the inside ends of the conductor paths protrude freely beyond the edge of the hole. The integrated circuit is inserted into said hole and the ends of the conductor paths extending beyond the edge of the hole establish electrical contact with respective places of the integrated circuit.
Inventors
- 👤 R Wiesner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 22:02
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/40; H10W70/421; H10W70/435; H10W74/00; H10W74/10; H10W74/111; H10W70/01; H10W70/05; H10W70/08; H10W70/09; H10W70/60; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/90; H10W72/941; H10W72/9413; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
139 words
A method of connecting an integrated circuit with outside electrical leads, whereby the integrated circuit is inserted into an insulating substrate upon which electrical conductance paths are vapor deposited or galvanically precipitated and an electrical contact is established between the conductor paths on the substrate and the integrated circuit, which comprises using as a substrate a single layer of an insulating material which can be etched, vapor depositing or galvanically precipitating conductance paths directly on a surface of said substrate, etching a hole into said substrate so that the inside ends of the conductor paths protrude freely in an unsupported manner beyond the edge of the hole, inserting the integrated circuit into the hole and electrically and mechanically contacting the ends of the conductor paths extending beyond the edge of the hole with respective places of the integrated circuit.
Claim 2
Independent Claim
139 words
A method of connecting an integrated circuit with outside electrical leads, whereby the integrated circuit is inserted into an insulating substrate upon which electrical conductance paths are vapor deposited or galvanically precipitated and an electrical contact is established between the conductor paths on the substrate and the integrated circuit, which comprises using as a substrate a single layer of an insulating material which can be etched, vapor depositing or galvanically precipitating conductance paths directly on a surface of said substrate, etching a hole into said substrate so that the inside ends of the conductor paths protrude freely in an unsupported manner beyond the edge of the hole, inserting the integrated circuit into the hole and electrically and mechanically contacting the ends of the conductor paths extending beyond the edge of the hole with respective places of the integrated circuit.
Claim 3
Dependent Claim
11 words
The method of claim 1, wherein the substrate material is glass.
Claim 4
Dependent Claim
12 words
The method of claim 1, wherein oxidized silicon is the substrAte material.
Claim 5
Dependent Claim
39 words
The method of claim 1, wherein the insulating substrate with the inserted integrated circuit, which is connected with the ends of the conductor paths which extend beyond the edge of the hole, is enclosed with a heat conducting insulator.
Claim 6
Dependent Claim
28 words
The method of claim 1, wherein the substrate, which contains the conductor paths is provided with a heat conducting electricity insulating plate which is pasted upon said substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-07-16 | 1977-01-15 | 1977-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-07-16 | 1981-01-15 | 1981-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-07-16 | 1985-01-15 | 1985-07-17 | $7700.00 | Window Closed / Lapsed |