Wafer breaker

Claim 2

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curved surface adapted to initially support thereon a flat scribed wafer; and b. non-resilient metal band means opposed to said platen initially tangentially related to the curved surface thereof and progressively conformable thereto by relative movement therebetween perpendicular to the surface of said wafer whereby a flat scribed wafer disposed between the curved surface of the platen and said means conformable thereto is broken along said scribe lines.

Claim 3

The combination according to claim 1, in which the curved surface on said platen means is curvilinear, said means opposed to said platen constitutes a flexible band, and the linear dimension of said curved surface extends transverse of said flexible band.

Claim 4

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines cut in one surface thereof, the combination comprising: a. means having a curved surface adapted to initially engage in line contact the side of a wafer remote from said scribe lines, said line engagement extending substantially parallel to said scribe lines; and b. means adapted to engage in non-slipping surface contact the initially flat scribed surface of a wafer the opposite side of which is engaged in line contact by said means having a curved surface; c. said means in surface contact with the scribed surface of the wafer comprising a non-resilient metal band progressively conformable to said curved surface by movement perpendicular thereto whereby said wafer is caused by said band to conform to said curved surface to thereby break said wafer into portions defined by said scribe lines.

Claim 5

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines cut in one surface thereof, the combination comprising: a. means having a curved surface adapted to initially engage in line contact the side of a wafer remote from said scribe lines, said line engagement extending substantially parallel to said scribe lines; and b. means adapted to engage in non-slipping surface contact the initially flat scribed surface of a wafer the opposite side of which is engaged in line contact by said means having a curved surface; c. said means in surface contact with the scribed surface of the wafer comprising a non-resilient metal band progressively conformable to said curved surface by movement perpendicular thereto whereby said wafer is caused by said band to conform to said curved surface to thereby break said wafer into portions defined by said scribe lines.

Claim 6

The combination according to claim 3, in which said means having a curved surface constitutes a platen movable from a flat wafer loading position through successive wafer breaking positions in which said wafer is made to conform to said platen and back to said flat wafer loading position.

Claim 7

The combination according to claim 3, in which said means having a curved surface constitutes a platen having a convex curvilinear surface thereon, said means adapted to engage the flat scribed surface of the wafer in surface contact constitutes a flexible band spaceD from said platen an amount sufficient to permit interposition of said wafer therebetween, and means for effecting wrapping of said band about the convex curvilinear surface of said platen.

Claim 8

The combination according to claim 3, in which control means are provided selectively operable to effect progressive conformability of said means in surface contact with the scribed surface of the wafer to said curved surface, and means disposed between said curved surface means and said band means to retain said band means from slipping in relation to said curved surface means.

Claim 9

The combination according to claim 3, in which said means having a curved surface constitutes a platen, said means conformable to the curved surface of said platen constitutes a flexible band, and said apparatus includes a housing divided into a wafer-breaking section and a power section, said platen and said band being enclosed within said wafer-breaking section of the housing.

Claim 10

The combination according to claim 3, in which said means having a curved surface comprises a platen, said means adapted to conform to said curved surface comprises a flexible band, said apparatus includes a frame on which said platen and said band are supported, and means are provided on said frame connected to said platen and said band and selectively operate to effect movement thereof to conform said band to said curved surface.

Claim 11

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; and b. tensioned strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said tensioned strap means, said tensioned strap means starting at said Y axis being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis to apply pressure progressively to the side of said wafer opposite said curved surface starting from said Y axis and progressing circumferentially thereabout whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis.

Claim 12

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; and b. tensioned strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said tensioned strap means, said tensioned strap means starting at said Y axis being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis to apply pressure progressively to the side of said wafer opposite said curved surface starting from said Y axis and progressing circumferentially thereabout whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis.

Claim 15

The method according to claim 10, in which tension is applied to said flexible band to effect cinching thereof around said curved surface.

Claim 16

The method according to claim 10, in which said curved surface is curvilinear, the straight lines forming said curved surface extending parallel to the Y axis of a system of XYZ axes, causing said curved surface to move in the direction of said Z axis, and tensioning said flexible band in the direction of said X axis while retaining the band agaInst slippage in relation to said wafer.

Claim 19

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curved surface adapted to initially support thereon a flat scribed wafer; and b. means opposed to said platen initially tangentially related to the curved surface thereof and progressively conformable thereto by relative movement therebetween perpendicular to the surface of said wafer whereby a flat scribed wafer disposed between the curved surface of the platen and said means conformable thereto is broken along said scribe lines; c. said means opposed to said platen means comprising a taut band resiliently anchored at each end, said platen means being movable against said band in opposition to said resilient anchoring means.

Claim 20

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curved surface adapted to initially support thereon a flat scribed wafer; and b. means opposed to said platen initially tangentially related to the curved surface thereof and progressively conformable thereto by relative movement therebetween perpendicular to the surface of said wafer whereby a flat scribed wafer disposed between the curved surface of the platen and said means conformable thereto is broken along said scribe lines; c. said means opposed to said platen means comprising a taut band resiliently anchored at each end, said platen means being movable against said band in opposition to said resilient anchoring means.

Claim 21

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curved surface adapted to initially support thereon a flat scribed wafer; and b. means opposed to said platen initially tangentially related to the curved surface thereof and progressively conformable thereto by relative movement therebetween perpendicular to the surface of said wafer whereby a flat scribed wafer disposed between the curved surface of the platen and said means conformable thereto is broken along said scribe lines; c. said means opposed to said platen means constituting a flexible band, means provided to tension said band, and means provided to move said platen in opposition to said band to effect cinching of said band about the curved surface of said platen means.

Claim 22

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curved surface adapted to initially support thereon a flat scribed wafer; and b. means opposed to said platen initially tangentially related to the curved surface thereof and progressively conformable thereto by relative movement therebetween perpendicular to the surface of said wafer whereby a flat scribed wafer disposed between the curved surface of the platen and said means conformable thereto is broken along said scribe lines; c. said means opposed to said platen means constituting a flexible band, means provided to tension said band, and means provided to move said platen in opposition to said band to effect cinching of said band about the curved surface of said platen means.

Claim 23

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curved surface adapted to initially support thereon a flat scribed wafer; and b. means opposed to said platen initially tangentially related to the curved surface thereof and progressively conformable thereto by relative movement therebetween perpendicular to the surface of said wafer whereby a flat scribed wafer disposed between the curved surface of the platen and said means conformable thereto is broken along said scribe lines; c. said means opposed to said platen means constituting a band, said platen means being movable relative to said band, and pneumatic circuit means including a pair of air cylinders provided to impose tension on said band in opposition to movement of said platen means thereagainst.

Claim 24

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curved surface adapted to initially support thereon a flat scribed wafer; and b. means opposed to said platen initially tangentially related to the curved surface thereof and progressively conformable thereto by relative movement therebetween perpendicular to the surface of said wafer whereby a flat scribed wafer disposed between the curved surface of the platen and said means conformable thereto is broken along said scribe lines; c. said means opposed to said platen means constituting a band, said platen means being movable relative to said band, and pneumatic circuit means including a pair of air cylinders provided to impose tension on said band in opposition to movement of said platen means thereagainst.

Claim 25

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comPrising: a. platen means having a curved surface adapted to initially support thereon a flat scribed wafer; and b. means opposed to said platen initially tangentially related to the curved surface thereof and progressively conformable thereto by relative movement therebetween perpendicular to the surface of said wafer whereby a flat scribed wafer disposed between the curved surface of the platen and said means conformable thereto is broken along said scribe lines; c. said means opposed to said platen means comprising a flexible band, and control means provided to effect progressive conformability of said band to the curved surface of said platen means so as to cinch a wafer interposed therebetween into conformity with the curvature of said platen means, said control means including an air cylinder operable to effect movement of said platen means, a pair of air cylinders attached to opposite ends of said flexible band to impose tension thereon, pressure regulator means for controlling the pressure in said air cylinders, valve means for controlling release of air under pressure to the air cylinder controlling movement of said platen means, and valve means actuated by said platen means upon completion of a predetermined excursion and effective to reverse the cycle to return the platen means to a wafer loading position and release tension on said flexible band.

Claim 26

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comPrising: a. platen means having a curved surface adapted to initially support thereon a flat scribed wafer; and b. means opposed to said platen initially tangentially related to the curved surface thereof and progressively conformable thereto by relative movement therebetween perpendicular to the surface of said wafer whereby a flat scribed wafer disposed between the curved surface of the platen and said means conformable thereto is broken along said scribe lines; c. said means opposed to said platen means comprising a flexible band, and control means provided to effect progressive conformability of said band to the curved surface of said platen means so as to cinch a wafer interposed therebetween into conformity with the curvature of said platen means, said control means including an air cylinder operable to effect movement of said platen means, a pair of air cylinders attached to opposite ends of said flexible band to impose tension thereon, pressure regulator means for controlling the pressure in said air cylinders, valve means for controlling release of air under pressure to the air cylinder controlling movement of said platen means, and valve means actuated by said platen means upon completion of a predetermined excursion and effective to reverse the cycle to return the platen means to a wafer loading position and release tension on said flexible band.

Claim 27

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines cut in one surface thereof, the combination comprising: a. means having a curved surface adapted to engage in line contact the side of a wafer remote from said scribe lines, said line engagement extending substantially parallel to said scribe lines; and b. means adapted to engage in surface contact the flat scribed surface of a wafer the opposite side of which is engaged in line contact by said curved surface; c. said means in surface contact with the scribed surface of the wafer being progressively conformable to said curved surface by movement perpendicular thereto whereby said wafer is caused to conform to said curved surface to thereby break said wafer into portions defined by said scribe lines; d. said means having a curved surface adapted to engage said wafer in line contact comprising a platen having a curvilinear surface thereon, said means adapted to engage the flat scribed surface of a wafer in surface contact comprising a taut flexible band disposed adjacent said curved surface of the platen whereby wrapping of said band about said platen effects breaking of said wafer first along a median scribe line and thence progressively simultaneously along scribe lines correspondingly spaced on opposite sides of said median scribe line.

Claim 28

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines cut in one surface thereof, the combination comprising: a. means having a curved surface adapted to engage in line contact the side of a wafer remote from said scribe lines, said line engagement extending substantially parallel to said scribe lines; and b. means adapted to engage in surface contact the flat scribed surface of a wafer the opposite side of which is engaged in line contact by said curved surface; c. said means in surface contact with the scribed surface of the wafer being progressively conformable to said curved surface by movement perpendicular thereto whereby said wafer is caused to conform to said curved surface to thereby break said wafer into portions defined by said scribe lines; d. said means having a curved surface adapted to engage said wafer in line contact comprising a platen having a curvilinear surface thereon, said means adapted to engage the flat scribed surface of a wafer in surface contact comprising a taut flexible band disposed adjacent said curved surface of the platen whereby wrapping of said band about said platen effects breaking of said wafer first along a median scribe line and thence progressively simultaneously along scribe lines correspondingly spaced on opposite sides of said median scribe line.

Claim 29

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines cut in one surface thereof, the combination comprising: a. means having a curved surface adapted to engage in line contact the side of a wafer remote from said scribe lines, said line engagement extending substantially parallel to said scribe lines; b. means adapted to engage in surface contact the flat scribed surface of a wafer the opposite side of which is engaged in line contact by said curved surface; c. said means in surface contact with the scribed surface of the wafer being progressively conformable to said curved surface by movement perpendicular thereto whereby said wafer is caused to conform to said curved surface to thereby break said wafer into portions defined by said scribe lines; and d. a pneumatic circuit including a plurality of selectively operable air cylinders, a pair of said air cylinders being connected to said flexible band and another of said cylinders being connected to said platen, and valve means for actuating said cylinder connected to said platen to effect movement of said platen in opposition to said band.

Claim 30

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines cut in one surface thereof, the combination comprising: a. means having a curved surface adapted to engage in line contact the side of a wafer remote from said scribe lines, said line engagement extending substantially parallel to said scribe lines; b. means adapted to engage in surface contact the flat scribed surface of a wafer the opposite side of which is engaged in line contact by said curved surface; c. said means in surface contact with the scribed surface of the wafer being progressively conformable to said curved surface by movement perpendicular thereto whereby said wafer is caused to conform to said curved surface to thereby break said wafer into portions defined by said scribe lines; and d. a pneumatic circuit including a plurality of selectively operable air cylinders, a pair of said air cylinders being connected to said flexible band and another of said cylinders being connected to said platen, and valve means for actuating said cylinder connected to said platen to effect movement of said platen in opposition to said band.

Claim 31

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines cut in one surface thereOf, the combination comprising: a. means having a curved surface adapted to engage in line contact the side of a wafer remote from said scribe lines, said line engagement extending substantially parallel to said scribe lines; and b. means adapted to engage in surface contact the flat scribed surface of a wafer the opposite side of which is engaged in line contact by said curved surface; c. said means in surface contact with the scribed surface of the wafer being progressively conformable to said curved surface by movement perpendicular thereto whereby said wafer is caused to conform to said curved surface to thereby break said wafer into portions defined by said scribe lines; d. said apparatus including a housing having a wafer-breaking section and a power section, and wafer support means are provided associated with said wafer-breaking section of the housing operable to support said wafer in said wafer-breaking section between said means having a curved surface and said means conformable thereto.

Claim 32

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines cut in one surface thereOf, the combination comprising: a. means having a curved surface adapted to engage in line contact the side of a wafer remote from said scribe lines, said line engagement extending substantially parallel to said scribe lines; and b. means adapted to engage in surface contact the flat scribed surface of a wafer the opposite side of which is engaged in line contact by said curved surface; c. said means in surface contact with the scribed surface of the wafer being progressively conformable to said curved surface by movement perpendicular thereto whereby said wafer is caused to conform to said curved surface to thereby break said wafer into portions defined by said scribe lines; d. said apparatus including a housing having a wafer-breaking section and a power section, and wafer support means are provided associated with said wafer-breaking section of the housing operable to support said wafer in said wafer-breaking section between said means having a curved surface and said means conformable thereto.

Claim 33

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; and c. means to impose tension on said strap means and for effecting movement of said strap means to effect progressive conformability of said strap means to said curvilinear surface.

Claim 34

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; and c. means to impose tension on said strap means and for effecting movement of said strap means to effect progressive conformability of said strap means to said curvilinear surface.

Claim 35

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; and b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; c. said apparatus including a housing including an intermediate support wall dividing said housing into a wafer-breaking section and the power section, said platen means and said strap means being enclosed within said wafer-breaking section, and power means provided within said power section and connected to said platen means and strap means to tension said strap and effect movement thereof to progressively conform the strap means to said platen means.

Claim 36

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; and b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; c. said apparatus including a housing including an intermediate support wall dividing said housing into a wafer-breaking section and the power section, said platen means and said strap means being enclosed within said wafer-breaking section, and power means provided within said power section and connected to said platen means and strap means to tension said strap and effect movement thereof to progressively conform the strap means to said platen means.

Claim 37

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and saId strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; and c. control means for controlling movement of said strap means and platen means, said control means including a pneumatic circuit having a plurality of air-actuated cylinders therein, one of said cylinders being operatively connected to said platen means, and a pair of said cylinders connected to opposite ends of said strap means whereby each cylinder acts in opposition to the other cylinders.

Claim 38

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and saId strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; and c. control means for controlling movement of said strap means and platen means, said control means including a pneumatic circuit having a plurality of air-actuated cylinders therein, one of said cylinders being operatively connected to said platen means, and a pair of said cylinders connected to opposite ends of said strap means whereby each cylinder acts in opposition to the other cylinders.

Claim 39

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; and c. a frame, said platen means and strap means being supported on said frame, and wafer support means mounted on said frame and selectively operable to insert an unbroken wafer between said platen means and said strap means and to withdraw said wafer therefrom after it has been broken.

Claim 40

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; and c. a frame, said platen means and strap means being supported on said frame, and wafer support means mounted on said frame and selectively operable to insert an unbroken wafer between said platen means and said strap means and to withdraw said wafer therefrom after it has been broken.

Claim 41

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; and b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; c. said apparatus including a frame, said platen means and strap means being supported on said frame, a wafer support assembly mounted on said frame for supporting a wafer oriented so that a selected set of scribe lines thereon lie parallel to said Y axis, said wafer support means including a feed slide movable to carry a properly oriented wafer between said platen means and said strap means, said strap means extending in the direction of said X axis, means associated with said strap means for imposing tension on said strap means in the direction of said X axis, means associated with said platen means for effecting movement of said platen in the direction of said Z axis whereby said strap means is caused to be wrapped around the curvilinear surface of said platen means to effect progressive breaking of said wafer along a first set of scribe lines, and means associated with said feed slide to effect rotation of said wafer by approximately 90* so as to reorient the wafer with the unbroken set of scribe lines parallel to said Y axis.

Claim 42

In an apparatus for breaking a flat semiconductor wafer along predefined scribe lines, the combination comprising: a. platen means having a curvilinear surface formed by lines parallel to the Y axis in a three dimensional XYZ system of axes and adapted to support thereon a wafer having scribe lines parallel to at least said Y axis; and b. strap means spaced from said curvilinear surface and initially abuttable against the flat scribed surface of a wafer disposed between said curvilinear surface and said strap means, said strap means being progressively conformable to portions of said curvilinear surface lying on opposite sides of said Y axis whereby said wafer is progressively broken first along one of said scribe lines coincident with said Y axis and then successively along pairs of said scribe lines formed by scribe lines correspondingly spaced on opposite sides of said Y axis; c. said apparatus including a frame, said platen means and strap means being supported on said frame, a wafer support assembly mounted on said frame for supporting a wafer oriented so that a selected set of scribe lines thereon lie parallel to said Y axis, said wafer support means including a feed slide movable to carry a properly oriented wafer between said platen means and said strap means, said strap means extending in the direction of said X axis, means associated with said strap means for imposing tension on said strap means in the direction of said X axis, means associated with said platen means for effecting movement of said platen in the direction of said Z axis whereby said strap means is caused to be wrapped around the curvilinear surface of said platen means to effect progressive breaking of said wafer along a first set of scribe lines, and means associated with said feed slide to effect rotation of said wafer by approximately 90* so as to reorient the wafer with the unbroken set of scribe lines parallel to said Y axis.