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US3741880A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of forming electrical connections in a semiconductor integrated circuit

Assignee: NEC Corp
•
Filing: 1970-10-22
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Granted: 1973-06-26
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Expires: 1990-10-22
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Abstract

Abstract A METHOD OF FORMING ELECTRICAL CONNECTION IN SEMICONDUCTOR INTEGRATED XCIRCUIT DEVICE IN WHICH AN ANODIZABLE METALLIC MATERIAL SUCH AS ALUMINUM IS FORMED ON A SUBSTRATE. ANODIC OXIDATION IS THEN PERFORMED TO FROM A THIN POROUS OXIDE FILM OF THE METALLIC MATERIAL. THE SURFACE OF THE POROUS OXIDE FILM IS THEN SELECTIVELY COVERED WITH A PHOTORESIT. THE EXPOSED SURFACE OF THE METALLIC MATERIAL IS THEN ANODIZED TO FROM A NON-POROUS METALLIC OXIDE FILM, WHICH THEREAFTER SEVES AS A MASK DURING THE

Inventors

  • 👤 H Shiba
  • 👤 H Tsunemitsu

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 12:12
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6302; H10P14/6324; C; C25; C25D; C25D11/00; C25D11/02; C25D11/022; C25D11/04; H10P14/6304; H10P14/6314; H10P14/66; H10P14/665; H10P14/69; H10P14/692; H10P14/6938; H10P14/6939; H10P14/69391; H10P95/00; H10W; H10W20/00; H10W20/40

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-06-25 1976-12-25 1977-06-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-06-25 1980-12-25 1981-06-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-06-25 1984-12-25 1985-06-26 $7700.00 Window Closed / Lapsed

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