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US3740900A Expired / Lapsed US ⏱️ 0.0 years remaining

Vacuum chuck assembly for semiconductor manufacture

Assignee: Signetics Corp
•
Filing: 1970-07-01
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Granted: 1973-06-26
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Expires: 1990-07-01
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Abstract

Abstract Apparatus for fabricating a dielectrically isolated semiconductor structure which includes a vacuum chuck assembly for use with a grinding machine with means for supplying a vacuum to the vacuum chuck. The vacuum chuck assembly consists of a body with a bore provided in the body and adapted to be connected to the source of vacuum. The body has a surface with a plurality of vacuum chucks carried thereby. The body and the vacuum chucks are formed with holes and passages which establish communication with the bore in the body so that a vacuum is supplied to the inserts whereby wafers from which the dielectrically isolated semiconductor structures are to be formed can be supported by and retained by the vacuum chucks. The apparatus also includes a wafer mounting jig which consists of a body having an annular recess therein opening through one side of the body. A flexible diaphragm extends over the annular recess and a cover plate is provided for securing the diaphragm to the body. The cover plate is formed with a plurality of holes overlying the recess and the diaphragm. A relatively noncompressible liquid fills the recess. A plurality of wafer mounting blocks are inserted in the recesses. Means is provided for yieldably retaining the blocks in the body whereby when a force is applied to one of the bodies, equalizing forces will be supplied by the liquid to the other mounting blocks so that all the mounting blocks are forced outwardly by the liquid by substantially equal forces. The apparatus also includes a mounting press which consists of a plate which is provided with means for cooling and heating the plate. A wafer guide member is provided which has a plurality of holes therein. Means is provided for mounting the guide member on the plate to permit vertical movement of the guide member relative to the plate. A plurality of mounting blocks are mounted in the holes. Each of the mounting blocks is adapted to receive a wafer. A bonding material such as wax is provided on the mounting blocks and pressure plate means is provided for applying pressure to the wafers so that the bonding agent will be uniformly and thinly distributed between each wafer and the associated mounting block. The method for fabricating a dielectrically isolated semiconductor structure consists of providing a semiconductor body with a first polished planar surface and then covering this polished surface with a protective material which has a substantially uniform thickness over the polished surface. The semiconductor body with the protected polished surface is then mounted on the vacuum chuck assembly with the polished surface facing the vacuum chuck assembly. The vacuum chuck assembly is then placed in a grinding machine and a second planar surface is provided which is parallel to the first polished surface to provide a semiconductor body of the desired thickness. Conventional steps are thereafter utilized to provide the dielectrically isolated semiconductor structure.

Inventors

  • 👤 A Youmans
  • 👤 L Saratoga

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 09:22
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/04; B24B37/07; B24B37/10; B24B37/102; B24B37/27

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 203 words
In apparatus for fabricating a dielectrically isolated semiconductor structure from semiconductor wafers, a vacuum chuck assembly for use with a grinding machine provided with a source of vacuum for connection to the vacuum chuck assembly, said vacuum chuck assembly including a metallic body, said body being formed with a bore adapted to be connected to the source of vacuum in the grinding machine, said body having a planar substantially uninterrupted surface, a plurality of separate vacuum chucks formed of a substantially non-deformable material which is harder than the body mounted on and carried by the surface of the body so that there are free spaces between the vacuum chucks, said vacuum chucks having exposed planar surfaces lying in a common plane, said body and said vacuum chucks being formed with holes in registration with each other establishing communication with the bore in the body so that a vacuum is supplied to said vacuum chucks whereby wafers may be held in place directly on the planar surfaces of the vacuum chucks while grinding operations are being carried out on the wafers, said vacuum chucks being formed with a plurality of concentric annular grooves opening through said planar surfaces and in communication with said holes.
Claim 2
Dependent Claim 203 words
In apparatus for fabricating a dielectrically isolated semiconductor structure from semiconductor wafers, a vacuum chuck assembly for use with a grinding machine provided with a source of vacuum for connection to the vacuum chuck assembly, said vacuum chuck assembly including a metallic body, said body being formed with a bore adapted to be connected to the source of vacuum in the grinding machine, said body having a planar substantially uninterrupted surface, a plurality of separate vacuum chucks formed of a substantially non-deformable material which is harder than the body mounted on and carried by the surface of the body so that there are free spaces between the vacuum chucks, said vacuum chucks having exposed planar surfaces lying in a common plane, said body and said vacuum chucks being formed with holes in registration with each other establishing communication with the bore in the body so that a vacuum is supplied to said vacuum chucks whereby wafers may be held in place directly on the planar surfaces of the vacuum chucks while grinding operations are being carried out on the wafers, said vacuum chucks being formed with a plurality of concentric annular grooves opening through said planar surfaces and in communication with said holes.
Claim 3
Dependent Claim 14 words
Apparatus as in claim 1 wherein said vacuum chucks are formed of a ceramic.
Claim 4
Dependent Claim 27 words
Apparatus as in claim 2 wherein said vacuum chucks are provided with metallization on the back side and wherein said vacuum chucks are brazed to the body.
Claim 5
Independent Claim 238 words
An apparatus for fabricating a dielectrically isolated semiconductor structure, a vacuum chuck assembly for use with a grinding machine provided with a source of vacuum for connection to the vacuum chuck assembly, said vacuum for connection to the vacuum chuck assembly, said vacuum chuck assembly including a body, said body being formed with a bore adapted to be connected to the source of vacuum in the grinding machine, said body having a planar surface, a removable cover plate mounted on said body, said body and said cover plate in combination being formed to provide radially extending channels which are in communication with said bore, said body and said cover also being formed with a plurality of annular channels which are in communication with said radially extending channels, a plurality of separate vacuum chucks mounted on and carried by the surface of the body with free spaces therebetween, said body having a plurality of holes spaced at points extending into said annular channels, each of said vacuum chucks having a plurality of holes in registration with the holes in said body so that communication is established with the bore in the body whereby a vacuum can be applied to the vacuum chucks, said vacuum chucks having planar surfaces lying in a common plane through which said holes extend whereby wafers may be held in place on the vacuum chucks while grinding operations are being carried out on the wafers.
Claim 6
Independent Claim 238 words
An apparatus for fabricating a dielectrically isolated semiconductor structure, a vacuum chuck assembly for use with a grinding machine provided with a source of vacuum for connection to the vacuum chuck assembly, said vacuum for connection to the vacuum chuck assembly, said vacuum chuck assembly including a body, said body being formed with a bore adapted to be connected to the source of vacuum in the grinding machine, said body having a planar surface, a removable cover plate mounted on said body, said body and said cover plate in combination being formed to provide radially extending channels which are in communication with said bore, said body and said cover also being formed with a plurality of annular channels which are in communication with said radially extending channels, a plurality of separate vacuum chucks mounted on and carried by the surface of the body with free spaces therebetween, said body having a plurality of holes spaced at points extending into said annular channels, each of said vacuum chucks having a plurality of holes in registration with the holes in said body so that communication is established with the bore in the body whereby a vacuum can be applied to the vacuum chucks, said vacuum chucks having planar surfaces lying in a common plane through which said holes extend whereby wafers may be held in place on the vacuum chucks while grinding operations are being carried out on the wafers.
Claim 7
Dependent Claim 28 words
Apparatus as in claim 4 wherein each of said vacuum chucks is provided with a plurality of annular grooves opening through the planar surfaces of said vacuum chucks.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-06-25 1976-12-25 1977-06-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-06-25 1980-12-25 1981-06-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-06-25 1984-12-25 1985-06-26 $7700.00 Window Closed / Lapsed

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