Patent US3736653A successfully refreshed from Google Patents.
US3736653A
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US
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Process for soldering using pre-fluxed solder powder
Assignee: NCR Voyix Corp
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Filing: 1971-12-01
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Granted: 1973-06-05
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Expires: 1991-12-01
Abstract
Abstract A solder powder is disclosed comprising minute particles of metallic alloy solder coated by a thin layer of rosin soldering flux such that the flux performs a triple function of: (a) insulating the individual alloy solder particles from electrical conductance; (b) adhesively holding individual particles of solder in place by virtue of the sticky characteristics of the preferred fluxes used to coat the solder powder; and (c) providing, when melted, an agent to clean substrates and workpieces to be joined by soldering.
Inventors
- 👤 T Maierson
- 👤 H Roe
- 👤 J Williams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 13:11
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/262; B23K35/02; B23K35/0222; B23K35/0244; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485
Claims Analysis
Total Claims: 1
Claim 1
Independent Claim
148 words
A process for manufacturing a soldered joint between metallic workpieces wherein the soldering material consists essentially of a multitude of individual minute solder particles each covered by a continuous coating of meltable flux material including the steps of: a. heating the soldering material, in an agitated, air-suspended state, to a temperature above that required for melting the flux material but below that required for melting the solder; b. contacting the heated soldering material with a surface of at least one of the metallic workpieces to be joined wherein the workpiece surface temperature is below the flux material melting point and wherein the flux material is thereby solidified and the soldering material adhereed to the workpiece; c. heating the workpiece surface to a temperature above the melting point of the solder; and d. contacting the workpieces to be joined with the soldering material therebetween to form a soldered joint.
References Cited (Backward Citations)
US1980927A
Cited
US2867037A
Cited
US3065538A
Cited
US3091029A
Cited
US3073270A
Cited
US3172385A
Cited
US3471310A
Cited
US3479231A
Cited
US3418179A
Cited
US3583063A
Cited
US3656226A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-06-04 | 1976-12-04 | 1977-06-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-06-04 | 1980-12-04 | 1981-06-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-06-04 | 1984-12-04 | 1985-06-05 | $7700.00 | Window Closed / Lapsed |