Solderless semiconductor devices

Claim 2

A semiconductor rectifier device comprising: a. a hollow electrical insulator; b. first and second spaced-apart metal members; c. a disc-like semiconductor body sandwiched between said members, said body having first and second oppositely disposed faces respectively adjoining and in contact with said members; d. a thin coating of inert non-metallic lubricating fluid comprising high viscosity silicone oil on at least one of the faces of said body, whereby relative sliding motion between said one face and the adjoining member is promoted; and e. means for joining said members to said insulator to form a sealed housing for said body.

Claim 3

A semiconductor rectifier device comprising: a. a hollow electrical insulator; b. first and second spaced-apart main electrodes of conductive material, said first electrode being generally disc-shaped And having a peripheral flange integrally connected thereto; c. a separate, removable metal ring seated on said flange and extending axially toward said second electrode; d. a disc-like body of semiconductor material disposed mechanically between and electrically in series with said electrodes, at least part of said body being located inside said ring which thereby centers the body with respect to said first electrode and, e. means for joining said electrodes to said insulator to form therewith a sealed housing for said body.

Claim 4

A semiconductor rectifier device comprising: a. a hollow electrical insulator; b. first and second spaced-apart main electrodes of conductive material, said first electrode being generally disc-shaped And having a peripheral flange integrally connected thereto; c. a separate, removable metal ring seated on said flange and extending axially toward said second electrode; d. a disc-like body of semiconductor material disposed mechanically between and electrically in series with said electrodes, at least part of said body being located inside said ring which thereby centers the body with respect to said first electrode and, e. means for joining said electrodes to said insulator to form therewith a sealed housing for said body.

Claim 5

The semiconductor device of claim 2 in which said disc-like body comprises a thin circular slice of semiconductor material having an axially projecting metallic substrate that is in contact with said first electrode, said substrate being the only part of said body encircled by said ring.

Claim 6

A semiconductor rectifier device comprising: a. a hollow electrical insulator; b. first and second spaced-apart main electrodes of conductive material, said first electrode being generally disc-shaped and having a peripheral flange integrally connected thereto; c. a metal ring seated on said flange and extending axially toward said second electrode; d. a disc-like body of semiconductor material sandwiched between said electrodes, said body having first and second oppositely disposed metal faces respectively adjoining and in contact with said first and second electrodes, the perimeter of said first metal face being located inside said ring which thereby centers the body with respect to said first electrode; e. a thin coating of silicone oil on the second metal face of said body, whereby relative sliding motion between said second face and said second electrode is promoted; and f. means for joining said electrodes to said insulator to form therewith a sealed housing for said body.

Claim 7

A semiconductor rectifier device comprising: a. a hollow electrical insulator; b. first and second spaced-apart main electrodes of conductive material, said first electrode being generally disc-shaped and having a peripheral flange integrally connected thereto; c. a metal ring seated on said flange and extending axially toward said second electrode; d. a disc-like body of semiconductor material sandwiched between said electrodes, said body having first and second oppositely disposed metal faces respectively adjoining and in contact with said first and second electrodes, the perimeter of said first metal face being located inside said ring which thereby centers the body with respect to said first electrode; e. a thin coating of silicone oil on the second metal face of said body, whereby relative sliding motion between said second face and said second electrode is promoted; and f. means for joining said electrodes to said insulator to form therewith a sealed housing for said body.