Compression bonded semiconductor device

Claim 1

IN COMBINATION, A SUBASSEMBLY INCLUDING A SEMICONDUCTOR WAFER, A LOWER CONDUCTIVE MOUNTING STUD, AN UPPER CONDUCTIVE MOUNTING STUD, AN UPPER AND LOWER CONDUCTIVE HEADER AND AN INSULATION RING CONNECTED BETWEEN THE OUTER PERIPHERIES OF SAID UPPER AND LOWER CONDUCTIVE HEADERS AND SEALING THE VOLUME INTERIOR OF SAID HEADERS; SAID UPPER AND LOWER CONDUCTIVE HEADS HAVING CENTERL FLAT SECTIONS; SAID SEMICONDUCTOR WAFTER BEING POSITIONED BETWEEN SAID CENTRAL FLAT SECTIONS OF SAID UPPER AND LOWER HEADERS; AND WAFER BEING LATERALLY MOVABLE WITH RESPECT TO SAID CENTRAL FLAT SECTION OF SAID LOWER HEADER BEING ERS; SAID CENTRAL FLAT SECTION OF SAID LOWER HEADER BEING MECHANICALLY AND ELECTRICALLY CONNECTED TO SAID LOWER CONDUCTIVE MOUNTING STUD; SAID CENTRAL FLAT SECTION OF SAID UPPER HEADER BEING MECHANICALLY AND ELECTRICALLY CONNECTED TO SAID UPPER CONDUCTIVE MOUNTING STUD; SAID UPPER CONDUCTIVE STUD HAVING A SHOULDER THEREIN; A SPRING WASHER HAVING A CENTRAL OPENING THEREIN; SAID SPRING WASHER HAVING A UNIFORM THICKNESS; FIRST AND SECOND AXIALLY SPACED CONDUCTIVE TUBULAR END RINGS; SAID INSULATION RING INTERPOSED BETWEEN AND MECHANICALLY CONNECTED TO THE OPPOSING ENDS OF SAID FIRST AND SECOND TUBULAR END RINGS; THE UPPER END OF SAID FIRST TUBULAR END RING DIRECTLY MECHANICALLY CONNECTED TO THE OUTER PERIPHERY OF SAID SPRING WASHER; THE LOWER END OF SAID SECOND TUBULAR END RING DIRECTLY CONNECTED TO SAID LOWER CONDUCTIVE STUD; THE INNER DIAMETER OF SAID CENTRAL OPENING OF SAID SPRING WASHER BEING MECHANICALLY CONNECTED TO SAID SHOULDER OF SAID UPPER CONDUCTIVE STUD THEREBY TO APPLY A COMPRESSIVE FORCE TO SAID UPPER AND LOWER HEADERS AND SAID WAFER INTERPOSED THEREBETWEEN.