Semiconductor devices with cooling plates

Claim 1

A SEMICONDUCTOR DEVICE, COMPRISING A SEMICONDUCTOR MEMBER HAVING A FLAT CRYSTALLINE BODY OF SEMICONDUCTOR MATERIAL WITH TWO REINFORCING PLATES ALLOY-BONDED TO THE RESPECTIVE FACES OF SAID BODY AND CONSISTING OF METAL WHOSE THERMAL COEFFICIENT OF EXPANSION IS SIMILAR TO THAT OF SAID SEMICONDUCTOR MATERIAL; A HOUSING HAVING AN INSULATING RING SURROUNDING SAID SEMICONDUCTOR MEMBER AND HAVING TOP AND BOTTOM COVERS OF METAL PERIPHERALLY AND GAS-TIGHTLY JOINED TO SAID RING ON AXIALLY OPPOSITE SIDES THEREOF RESPECTIVELY AND IN FACE-TO-FACE CONTACT WITH SAID RESPECTIVE REINFORCING PLATES; TWO COOLING STRUCTURES EACH LOCATED ON OPPOSITE SIDES OF SAID HOUSING; AND MEANS FOR PRESSING SAID COOLING STRUCTURES IN HEAT CONDUCTIVE CONTACT WITH SAID RESPECTIVE COVERS, EACH OF SAID COOLING STRUCTURES COMPRISING A COOLING PLATE HAVING A MIDDLE PORTION IN FACE-TO-FACE ENGAGEMENT WITH ONE OF SAID RESPECTIVE COVERS AND TWO LATERAL PORTIONS EXTENDING AWAY FROM SAID MIDDLE PORTION IN DIAMETRICALLY OPPOSITE RELATION TO SAID SEMICONDUCTOR MEMBER AND PROTRUDING BEYOND SAID SEMICONDUCTOR MEMBER FOR EXPOSURE TO HEAT DISSIPATING COOLANT, EACH SAID COOLING PLATE HAVING ITS LARGEST THICKNESS IN SAID MIDDLE PORTION AND HAVING IN EACH OF SAID LATERAL PORTIONS A CROSS-SECTIONAL SHAPE TAPERING IN THE DIRECTION FROM SAID MIDDLE PORTION TOWARD THE PROTRUDING END.