Patent US3735485A successfully refreshed from Google Patents.
US3735485A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of providing thermally conductive ground connections for integrated circuits
Assignee: Motorola Solutions Inc
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Filing: 1971-01-25
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Granted: 1973-05-29
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Expires: 1991-01-25
Abstract
Abstract A method for providing thermally conductive ground connections for semiconductor devices is provided in which a thermally and electrically conductive plug is put into a hole in a substrate before or after conductive material is deposited on the back of the substrate and then the conductive material is made thick enough to provide a ground plane to retain the plug in place and to make thermal and electrical connections between the plug and the ground plane. Then the integrated circuit may be bonded to the top of the plug.
Inventors
- 👤 R Wilson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:46
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/01; H10W40/03; H10W40/037; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W70/00; H10W70/01; H10W70/02; H10W70/027; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W90/00; H10W90/701; H10W90/731; H10W90/737; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/4914; Y10T29/49142
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
142 words
The method of providing an electrical equipment which comprises: providing an insulating substrate having first and second surfaces and having a hole therethrough; forcing a conductive plug into said hole so that a first end of said plug is substantially flush with said first surface of said substrate and a second end of said plug is below said second surface of said substrate by a distance substantially equal to the thickness of a semiconductor device to be put on said plug, said plug being retained in said hole by mechanical interaction of the outside surface of said plug and the inside surface of said hole; applying metalization to said first surface of said substrate; building up said metalization to provide a ground plane which is integrally fixed to said plug; and securing a semiconductor device to said second end of said plug.
Claim 2
Independent Claim
142 words
The method of providing an electrical equipment which comprises: providing an insulating substrate having first and second surfaces and having a hole therethrough; forcing a conductive plug into said hole so that a first end of said plug is substantially flush with said first surface of said substrate and a second end of said plug is below said second surface of said substrate by a distance substantially equal to the thickness of a semiconductor device to be put on said plug, said plug being retained in said hole by mechanical interaction of the outside surface of said plug and the inside surface of said hole; applying metalization to said first surface of said substrate; building up said metalization to provide a ground plane which is integrally fixed to said plug; and securing a semiconductor device to said second end of said plug.
Claim 3
Dependent Claim
19 words
The invention of claim 1 in which said insulating substrate is of ceramic material and said plug is copper.
Claim 4
Dependent Claim
18 words
The invention of claim 1 in which said metallization is provided by sputtering said surface of said substrate.
Claim 5
Dependent Claim
18 words
The invention of claim 1 in which said metallization is provided by vacuum evaporation of a suitable metal.
Claim 6
Dependent Claim
19 words
The invention of claim 1 in which said metallization is provided before said plug is forced into said hole.
Claim 7
Dependent Claim
19 words
The invention of claim 1 in which said metallization is provided after said plug is forced into said hole.
Claim 8
Dependent Claim
14 words
The invention of claim 1 in which said building up is provided by electroplating.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-05-28 | 1976-11-27 | 1977-05-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-05-28 | 1980-11-27 | 1981-05-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-05-28 | 1984-11-27 | 1985-05-29 | $7700.00 | Window Closed / Lapsed |