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US3735484A Expired / Lapsed US ⏱️ 0.0 years remaining

Non-corrosive coating for thin aluminum metallization

Assignee: Motorola Solutions Inc
•
Filing: 1970-12-17
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Granted: 1973-05-29
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Expires: 1990-12-17
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Abstract

Abstract To prevent corrosion of aluminum metallization of semiconductor devices, the device, including the aluminum metallization thereof is phosphated with a phosphate solution that includes no sodium. The phosphating may take place before the leads are provided or after. Portions of the phosphated surface may be covered by deposited glass. Then the phosphated semiconductor device or IC may be encapsulated in a plastic material in a known manner.

Inventors

  • 👤 H Gurev
  • 👤 R Kirk

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 15:49
CPC Classifications
C; C23; C23G; C23G1/00; C23G1/14; C23G1/22; C23C; C23C22/00; C23C22/05; C23C22/06; C23C22/07; C23C22/08; C23C22/34; C23C22/37; C23C22/38; H; H10; H10P; H10P95/00; Y; Y10; Y10S; Y10S438/00; Y10S438/906

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 13 words
The method of claim 1 in which said bonding is by thermal compression.
Claim 2
Dependent Claim 11 words
The method of claim 1 in which said bonding is ultrasonic.
Claim 3
Dependent Claim 38 words
The method of claim 1 and further including the step of covering the phosphated device with an insulating coating, etching holes through said coating and making at least one electrical connection to said phosphated device through a hole.

References Cited (Backward Citations)

US3415766A Cited
US3632433A Cited
US3621563A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-05-28 1976-11-27 1977-05-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-05-28 1980-11-27 1981-05-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-05-28 1984-11-27 1985-05-29 $7700.00 Window Closed / Lapsed

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