Copper plating
Abstract
Abstract THE PRESENT INVENTION RELATES TO IMPROVED EXTENDER COMPOSITIONS USED IN COPPER ELECTROPLATING COMPRISING A MIXTURE OF A SULFURIZED SULFONATED AROMATIC OR HYDROAROMATIC HYDROCARBON, OR SUBSTITUTION PRODUCT THEREOF, AN AMINO DERIVATIVE OF A TRIARYLMETHANE, AND AS A LEVELING AGENT A COMPOUND CONTAINING A RADICAL SELECTED FROM THE GROUP CONSISTING OF -N=C(-SH)-N=, -N=C(-SH)-S-, AND >N-C(=S)-S- THE COMBINATION OF THE THREE TYPES OF INGREDIENTS GIVES AN ADDITIVE COMPOSITION OF A SYNERGISTIC CHARACTER WHEN USED IN COPPER PLATING IN THE FORM OF IMPROVED BRIGHTNESS AND LEVELING OVER A WIDER RANGE OF CURRENT DENSITY THAN PREVIOUS ADDITIVE COMPOSITIONS, AND ARE PARTICULARLY IMPROVED WITH RESPECT TO LEVELING.
Inventors
- 👤 C Abbott
Bibliographic Details
Claims Analysis
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-05-07 | 1976-11-06 | 1977-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-05-07 | 1980-11-06 | 1981-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-05-07 | 1984-11-06 | 1985-05-08 | $7700.00 | Window Closed / Lapsed |