Cavity structure

Claim 2

In an electronic microcircuit package of the type including a base member defining a cavity bounded by a bottom surface and adjoining side wall surfaces receptive of a coating of adherent bonding material adapted to bond an electronic microcircuit component within the confines of said cavity, the improvement wherein said bottom and side wall surfaces converge together in such manner as to define an outwardly rounded or obtused junction therebetween.

Claim 3

An article according to claim 1 wherein the junction of said walls and said bottom surface is outwardly obtuse to define an angle greater than about 95*.

Claim 4

An article according to claim 2 wherein said angle is greater than about 120*.

Claim 5

An article according to claim 2 wherein said angle is about 135*.

Claim 6

An article according to claim 1 wherein the junction of said side wall which will be in contact with said bonding material and said bottom surface is rounded to the extent that the ratio r/H is greater than about 0.2; wherein r is the radius of said junction and H is the height of the material which will be on said side wall.

Claim 7

An article according to claim 5 wherein said ratio is greater than about 0.5.

Claim 8

An article according to claim 5 wherein said ratio is about 0.8-1.0.

Claim 9

An article according to claim 1 wherein said cavity includes a plurality of adjoining side walls surrounding said cavity, and said bonding material will contact substantially all of said surrounding walls and substantially the entire bottom surface of said cavity, and wherein the junctions formed by each of said adjoining side walls are rounded to the extent that R/H is greater than about 2.0; wherein R is the radius of each of said junctions between said side walls and H is the height of the material which will be on said side walls.

Claim 10

An article according to claim 8 wherein said ratio is about 4.0.

Claim 11

The improvement as defined in claim 1, wherein said junction is rounded to define a radius about 0.02 inch.

Claim 12

The improvement as defined in claim 1, wherein said junction is rounded and defines a radius of about 0.004 - 0.005 inch.

Claim 13

The improvement as defined in claim 1, wherein said electronic microcircuit component is a silicon chip and said bonding material is comprised of gold.

Claim 14

An article of manufacture comprising a base member provided with a substantially rectangular cavity defined by a bottom surface and surrounding walls, said cavity having a length of about 0.146 inch, a width of about 0.116 inch, and a depth of about 0.005 inch, said cavity being adapted to receive a layer of a material in contact with at least a portion of said bottom surface and at least a portion of said walls, the junction of said walls and said bottom surface in contact with said material being rounded or obtused to an extent sufficient to at least substantially limit any peel-back of said material in contact with said cavity walls and bottom surface.

Claim 15

An article of manufacture comprising a base member provided with a substantially rectangular cavity defined by a bottom surface and surrounding walls, said cavity having a length of about 0.146 inch, a width of about 0.116 inch, and a depth of about 0.005 inch, said cavity being adapted to receive a layer of a material in contact with at least a portion of said bottom surface and at least a portion of said walls, the junction of said walls and said bottom surface in contact with said material being rounded or obtused to an extent sufficient to at least substantially limit any peel-back of said material in contact with said cavity walls and bottom surface.

Claim 16

An article according to claim 13 wherein the junction formed by adjacent walls are rounded to a radius of about 0.02 inch.

Claim 17

An article according to claim 14 wherein the junction of said walls and said bottom surface is rounded to a radius of about 0.004-0.005 inch.

Claim 18

An article according to claim 15 wherein said article is a substrate for encapsulating within said cavity a silicon chip integrated circuit connected to said substrate by a gold-glass binder pad.

Claim 19

An article according to claim 13 wherein the angle formed at the junction of said walls and said bottom surface is outwardly obtuse and is about 135*.

Claim 20

An article according to claim 13, wherein said junction is outwardly obtuse and defines an angle of greater than about 95*.