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US3727304A Expired / Lapsed US ⏱️ 0.0 years remaining

Plated wire memory fabrication

Assignee: Honeywell Inc
•
Filing: 1970-09-28
•
Granted: 1973-04-17
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Expires: 1990-09-28
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Abstract

Abstract A plated wire thin film memory assembly and fabrication method is shown and described wherein the plated wire is contained in a ''''tunnel structure'''' sandwiched between layers of a multi-layer printed circuit assembly.

Inventors

  • 👤 J Granato
  • 👤 R Moore

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 16:37
CPC Classifications
H; H01; H01F; H01F10/00; H01F10/06; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/4902; Y10T29/49069

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 148 words
The method of making a memory plane comprising the steps of: forming evenly spaced circular tunnels in a semi-rigid insulative tunnel substrate; inserting wires plated with a magnetic material in the tunnels, the relative diameters of the tunnels and wires being such as to provide a loose fit; forming a multi-layered assembly by providing a coating of magnetically permeable material to portions of one side of a second substrate, affixing a set of conductors into the permeable material and over said portions of the second substrate, affixing conductive material on the opposite side of the second substrate, and, removing portions of the conductive material to form circuitry for interconnecting the conductor set with external circuitry; and, bonding the tunnel substrate containing plated wires between two of said multi-layered assemblies with the conductor sets adjacent to the tunnel substrate and between the tunnel substrate and the magnetically permeable material.
Claim 2
Independent Claim 148 words
The method of making a memory plane comprising the steps of: forming evenly spaced circular tunnels in a semi-rigid insulative tunnel substrate; inserting wires plated with a magnetic material in the tunnels, the relative diameters of the tunnels and wires being such as to provide a loose fit; forming a multi-layered assembly by providing a coating of magnetically permeable material to portions of one side of a second substrate, affixing a set of conductors into the permeable material and over said portions of the second substrate, affixing conductive material on the opposite side of the second substrate, and, removing portions of the conductive material to form circuitry for interconnecting the conductor set with external circuitry; and, bonding the tunnel substrate containing plated wires between two of said multi-layered assemblies with the conductor sets adjacent to the tunnel substrate and between the tunnel substrate and the magnetically permeable material.
Claim 3
Dependent Claim 60 words
The method of claim 1 wherein the step of forming a multi-layered assembly comprises: placing a layer of magnetic material on one side of a sheet of glass epoxy; printing copper straps on portions of the magnetic material; placing a layer of gold over the straps; and, etching away the magnetic material that is not covered by the copper straps.

References Cited (Backward Citations)

US3487385A Cited
US3296099A Cited
US3465432A Cited
US3538599A Cited
US3513538A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-04-16 1976-10-16 1977-04-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-04-16 1980-10-16 1981-04-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-04-16 1984-10-16 1985-04-17 $7700.00 Window Closed / Lapsed

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