Opto-isolator devices and method for the fabrication thereof

Claim 2

Opto-isolator devices comprising: a. a semiconductor light-emitting diode attached to a jogged bonding pad of an electrical input lead; b. a semiconductor photo-responsive device attached to a jogged bonding pad of an electrical output lead in face-torelationship with said light-emitting diode; c. conductive means connecting said light-emitting diode with a lead to an electrical input source; d. conductive means connecting said photo-responsive device to at least one lead to an electrical output circuit; e. means for optically and mechanically coupling said lightemitting diode and said photo-responsive device; f. opaque encapsulation means for the optically and mechanically coupled light-emitting diode and photo-responsive device, conductive means of elements (c) and (d), and a portion of said input and output leads which are formed into a dual-in-line configuration outside said encapsulation means.

Claim 3

Opto-isolator devices according to claim 1 wherein said conductive means for said light-emitting diode and said photo-responsive device is gold wire; said means for optically and mechanically coupling said light-emitting diode and said photo-responsive device is a clear silicone material, and said opaque encapsulation means is a black silicone material.

Claim 4

Opto-isolator devices according to claim 2 wherein said light-emitting diode is gallium arsenide.

Claim 5

Opto-isolator devices according to claim 3 wherein said photo-responsive device is a silicon photo-diode.

Claim 6

Opto-isolator devices according to claim 3 wherein said photo-responsive device is a silicon photo-transistor.

Claim 7

Opto-isolator devices according to claim 3 wherein said photo-responsive device is a photo-SCR.

Claim 8

Opto-isolator devices according to claim 3 wherein said photo-responsive device is a photo-FET.

Claim 9

Opto-isolator devices according to claim 3 wherein said photo-responsive device is a photo-sensitive integrated circuit.

Claim 10

Lead frame-mounted opto-isolator packages for radiation emitters which are optically coupled to radiation detectors including, in combination: a. a first conductive lead frame comprising a plurality of conductive lead members and bonding pads which are off-set with respect to said lead members, b. radiation-emissive semiconductor devices bonded to said pads therefor and adapted to be energized with an electrical current and responsive thereto to generate radiation of a predetermined wavelength, c. a second lead frame comprising a plurality of conductive lead members and also having bonding pads which are off-set with respect to its lead members, d. radiation detector semiconductor devices bonded to said pads therefor of said second lead frame and adapted to be energized and responsive to radiation emitted from said radiation-emissive semiconductor devices, e. conductive means connecting said radiation-emissive and radiation detector devices, respectively, with lead members on said first and second lead frames, and f. coupling means for said first and second lead frames rigidly positioning them and their bonding pads in a predetermined and fixed spaced apart relationship whereby the off-set bonding pads permit said radiation emitters and detectors, respectively, to be spaced apart in face-to-face relationship, and optically coupled.

Claim 11

Lead frame-mounted opto-isolator packages for radiation emitters which are optically coupled to radiation detectors including, in combination: a. a first conductive lead frame comprising a plurality of conductive lead members and bonding pads which are off-set with respect to said lead members, b. radiation-emissive semiconductor devices bonded to said pads therefor and adapted to be energized with an electrical current and responsive thereto to generate radiation of a predetermined wavelength, c. a second lead frame comprising a plurality of conductive lead members and also having bonding pads which are off-set with respect to its lead members, d. radiation detector semiconductor devices bonded to said pads therefor of said second lead frame and adapted to be energized and responsive to radiation emitted from said radiation-emissive semiconductor devices, e. conductive means connecting said radiation-emissive and radiation detector devices, respectively, with lead members on said first and second lead frames, and f. coupling means for said first and second lead frames rigidly positioning them and their bonding pads in a predetermined and fixed spaced apart relationship whereby the off-set bonding pads permit said radiation emitters and detectors, respectively, to be spaced apart in face-to-face relationship, and optically coupled.

Claim 12

The packages defined in claim 9 wherein said means for maintaining said lead frames in a spaced-apart relationship includes a light-transmitting silicone resin encapsulating said emitters and detectors and provides an optical path therebetween.

Claim 13

The packages defined in claim 9 wherein said first and second lead frames and coupling means are encapsulated in opaque plastic so that the conductive lead members extend from said plastic encapsulation and may be oriented for connection to desired electrical apparatus.