Patent US3721867A successfully refreshed from Google Patents.
US3721867A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tablet-shaped semiconductor component and process for its manufacture
Assignee: Semikron GmbH and Co KG
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Filing: 1971-03-25
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Granted: 1973-03-20
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Expires: 1991-03-25
Abstract
Abstract A semiconductor wafer is completely encapsulated between two metal parts contacting its opposite faces and serving as circuit contact areas. Peripherally surrounding the wafer is an insulating member to which the metal parts are sealed.
Inventors
- 👤 W Schierz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:38
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
183 words
A tablet-shaped semiconductor component comprising a semiconductor body including a wafer of semiconductor material, said semiconductor body having an upper face and a lower face, the faces being mutually separated by a peripheral edge surface, an upper metallic part means contacting the upper face of said body, a lower metallic part means contacting the lower face of said body, a peripheral insulating member together with the upper and the lower metallic part means forming a tablet-shaped housing for said body, and a sealing ring seated in a lower face of the peripheral member, said upper part means having means for receiving said body, said upper part means having a smaller expanse parallel to the plane of the wafer faces than said lower part means, said upper part means being soldered and sealed to said peripheral member, said peripheral member having a continuous closed shaping on its axial outer surface adjoined to said lower part means having a first beaded area which has an outer edge beaded over said shaping of said peripheral member, said lower part means bearing continuously against said sealing ring.
Claim 2
Dependent Claim
183 words
A tablet-shaped semiconductor component comprising a semiconductor body including a wafer of semiconductor material, said semiconductor body having an upper face and a lower face, the faces being mutually separated by a peripheral edge surface, an upper metallic part means contacting the upper face of said body, a lower metallic part means contacting the lower face of said body, a peripheral insulating member together with the upper and the lower metallic part means forming a tablet-shaped housing for said body, and a sealing ring seated in a lower face of the peripheral member, said upper part means having means for receiving said body, said upper part means having a smaller expanse parallel to the plane of the wafer faces than said lower part means, said upper part means being soldered and sealed to said peripheral member, said peripheral member having a continuous closed shaping on its axial outer surface adjoined to said lower part means having a first beaded area which has an outer edge beaded over said shaping of said peripheral member, said lower part means bearing continuously against said sealing ring.
Claim 3
Dependent Claim
25 words
A tablet-shaped semiconductor component as claimed in claim 1, further comprising bead means for compensating relative thermal expansions between said body and said peripheral member.
Claim 4
Dependent Claim
24 words
A tablet-shaped semiconductor component as claimed in claim 2, said bead means being additionally means for centering said body relative to said peripheral member.
Claim 5
Dependent Claim
23 words
A tablet-shaped semiconductor component as claimed in claim 1, said upper and lower metallic part means being of thermally and electrically conducting material.
Claim 6
Dependent Claim
28 words
A tablet-shaped semiconductor component as claimed in claim 4, said upper and lower metallic part means being planar and smooth for electrical and thermal contact with said body.
Claim 7
Dependent Claim
40 words
A tablet-shaped semiconductor component as claimed in claim 1, further comprising means on said peripheral member for promoting the soldering of the upper metallic part to the peripheral member and for receiving the upper metallic part on the peripheral member.
Claim 8
Dependent Claim
44 words
A tablet-shaped semiconductor component as claimed in claim 1, said metallic part means comprising noble metal foils on both faces of said body, inner contact discs abutting against said metal foils and outer contact discs having faces exposed for contact with an external circuit.
Claim 9
Dependent Claim
80 words
A tablet-shaped semiconductor component as claimed in claim 7, said upper metallic part means further comprising an annular disc means for connecting the outer cOntact disc of said upper metallic part means sealedly and securely to said peripheral member, said annular disc means having an upper head means centrally located between the outer contact disc of said upper metallic part means and said peripheral member for accommodating relative thermal expansions between said upper metallic part means and said peripheral member.
Claim 10
Dependent Claim
27 words
A tablet-shaped semiconductor component as claimed in claim 8, further comprising a filler body means for centering said body and said foils relative to said peripheral member.
Claim 11
Dependent Claim
84 words
A method for manufacturing a semiconductor component as claimed in claim 1, comprising the steps of soldering and sealing said upper metallic part means to said peripheral member, placing said body into the thus-formed assembly of upper metallic part means and peripheral member in contact with said upper metallic part means, placing said sealing ring in the lower face of the peripheral member, and beading the outer edge of said lower part means over said shaping for placing said body under positive mechanical stress.
Claim 12
Dependent Claim
24 words
A method as claimed in claim 10, further comprising the step of centering said body relative to the peripheral member with a filler body.
Claim 13
Dependent Claim
30 words
A tablet-shaped semiconductor component as claimed in claim 1, said continuous closed shaping on the axial outer surface of the peripheral member being formed as a flange or a recess.
Claim 14
Dependent Claim
27 words
A tablet-shaped semiconductor component as claimed in claim 1, said continuous closed shaping on the axial outer surface of the peripheral member being formed as a recess.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-03-19 | 1976-09-18 | 1977-03-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-03-19 | 1980-09-18 | 1981-03-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-03-19 | 1984-09-18 | 1985-03-20 | $7700.00 | Window Closed / Lapsed |