Bonding tip

Claim 2

A pressure bonding tip for producing an extremely strong wedge-type wire bond on a contact pad of a semiconductor device without producing significant necking between the bonded and connected unbonded portion of a wire of substantially circular cross-section, said bonding tip comprising an elongated member, a flat bonding surface on one end of said member for compressing a portion of said wire against said semiconductor device contact pad and bonding it thereto, said member having first and second spaced apart grooves each of which being semicircular-like in cross-section, said grooves extending inwardly toward one another from opposing sides of said member at said one end and intersecting opposite edges of said bonding surface, each of said grooves being at an angle of about 30*-60* with said surface, the depth of each of said grooves at the edge of said bonding surface being about 0.5-1.5 times the diameter of said wire, and means adjacent said first groove for guiding said wire under said flat bonding surface and for maintaining the unbonded portion of the wire adjacent the bonded portion generally coaxially aligned with said first groove.

Claim 3

A pressure bonding tip for producing an extremely strong tailless wedge-type wire bond on a contact pad of a conductor device without producing significant necking between the bonded and connected unbonded portion of a wire of substantially circular cross-section, said bonding tip comprising an elongated member, a flat bonding surface on one end of said member for compressing a portion of said wire against said semiconductor device contact pad and bonding it thereto, said member having first and second spaced apart grooves each of which being semicircular-like in cross-section, said grooves extending inwardly toward one another from opposing sides thereof at said one end and intersecting opposite edges of said bonding surface, each of said grooves being at an angle of about 30*-60* with said surface, the depth of each of said grooves at the edge of said bonding surface being about 0.75-1.25 times the diameter of said wire and the radius of curvature of each of said grooves being about 0.75-1.5 times the diameter of said wire, and means adjacent said first groove for guiding said wire under said flat bonding surface and for maintaining an unbonded portion of said wire adjacent the bond generally coaxially aligned with said first groove while said flat bonding surface is in pressing engagement with the wire on the contact pad so that a tailless bond can be produced by pulling the connected unbonded portion of the wire coaxially with said first groove to remove a preselected edge section of the bonded portion while it is compressed against the contact pad by said bonding surface.

Claim 4

A pressure bonding tip for producing an extremely strong tailless wedge-type wire bond on a contact pad of a conductor device without producing significant necking between the bonded and connected unbonded portion of a wire of substantially circular cross-section, said bonding tip comprising an elongated member, a flat bonding surface on one end of said member for compressing a portion of said wire against said semiconductor device contact pad and bonding it thereto, said member having first and second spaced apart grooves each of which being semicircular-like in cross-section, said grooves extending inwardly toward one another from opposing sides thereof at said one end and intersecting opposite edges of said bonding surface, each of said grooves being at an angle of about 30*-60* with said surface, the depth of each of said grooves at the edge of said bonding surface being about 0.75-1.25 times the diameter of said wire and the radius of curvature of each of said grooves being about 0.75-1.5 times the diameter of said wire, and means adjacent said first groove for guiding said wire under said flat bonding surface and for maintaining an unbonded portion of said wire adjacent the bond generally coaxially aligned with said first groove while said flat bonding surface is in pressing engagement with the wire on the contact pad so that a tailless bond can be produced by pulling the connected unbonded portion of the wire coaxially with said first groove to remove a preselected edge section of the bonded portion while it is compressed against the contact pad by said bonding surface.

Claim 5

A bonding tip of tungsten carbide for pressure bonding a preselected diameter of gold wire producing an extremely strong tailless wedge-type bond on a contact pad of an integrated circuit without producing significant necking between the bonded and connected unbonded portion of the wire, said bonding tip comprising an elongated member, a bonding step portion on one enD of said member, a wire guide step portion on said one end of said member adjacent said bonding step portion, a flat bonding surface on said bonding step portion for compressing a portion of the wire against an integrated circuit contact pad and bonding it thereto, said bonding step portion having first and second semicircular-like grooves spaced from each other about 1.0 times the wire diameter, said grooves extending inwardly toward one another from opposite sides of said bonding step portion intersecting opposite edges of said bonding surface at an angle of about 45*, the depth of each of said grooves at the edge of said bonding surface being about equal to the diameter of the wire and the radius of curvature of each of said grooves being about equal to that of the wire, said wire guide portion having a channel therethrough, said channel being generally coaxial with said first groove and terminating adjacent thereto for guiding the preselected wire under said bonding surface and for maintaining the connected unbonded wire in said first groove when the flat bonding surface is in pressing engagement with the wire on the contact pad so that a tailless bond can be provided by pulling the connected unbonded portion of the wire coaxially along said channel to remove a preselected edge region of said bonded portion while it is still in contact with said bonding surface.

Claim 6

A bonding tip of tungsten carbide for pressure bonding a preselected diameter of gold wire producing an extremely strong tailless wedge-type bond on a contact pad of an integrated circuit without producing significant necking between the bonded and connected unbonded portion of the wire, said bonding tip comprising an elongated member, a bonding step portion on one enD of said member, a wire guide step portion on said one end of said member adjacent said bonding step portion, a flat bonding surface on said bonding step portion for compressing a portion of the wire against an integrated circuit contact pad and bonding it thereto, said bonding step portion having first and second semicircular-like grooves spaced from each other about 1.0 times the wire diameter, said grooves extending inwardly toward one another from opposite sides of said bonding step portion intersecting opposite edges of said bonding surface at an angle of about 45*, the depth of each of said grooves at the edge of said bonding surface being about equal to the diameter of the wire and the radius of curvature of each of said grooves being about equal to that of the wire, said wire guide portion having a channel therethrough, said channel being generally coaxial with said first groove and terminating adjacent thereto for guiding the preselected wire under said bonding surface and for maintaining the connected unbonded wire in said first groove when the flat bonding surface is in pressing engagement with the wire on the contact pad so that a tailless bond can be provided by pulling the connected unbonded portion of the wire coaxially along said channel to remove a preselected edge region of said bonded portion while it is still in contact with said bonding surface.