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US3717523A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of gas-tight sealing of semiconductor components

Assignee: Siemens AG
•
Filing: 1971-08-23
•
Granted: 1973-02-20
•
Expires: 1991-08-23
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Abstract

Abstract For a gas-tight sealing of a semiconductor in a metal housing, the housing is preheated. An annular tablet of epoxide resin is then placed on the housing. While the housing slowly cools off, the tablet melts and seals the component by fusion.

Inventors

  • 👤 H Dunsche

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 06:39
CPC Classifications
B; B29; B29C; B29C65/00; B29C65/48; B29C65/4805; B29C65/481; B29C65/4815; B29C66/00; B29C66/50; B29C66/51; B29C66/53; B29C66/534; B29C66/5344; B29C66/5346; B29C66/61; B29C66/612; B29C66/70; B29C66/71; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49826; Y10T29/49833; Y10T29/49908; Y10T29/49936

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 116 words
A method of gas-tight sealing of a semiconductor component in a cup-shaped metal housing which functions as an electric lead for a semiconductor system housed therein and which has an upper rim and an upper open portion covered by a cover of insulating material in pressure-contact with the housing, the semiconductor system having another electric lead passing through the cover of the housing, said method comprising heating the housing; and placing a substantially annular tablet of homogenous synthetic material on the upper rim of the housing whereby the tablet melts due to the preheating of the housing and fuses to fill the part of the housing which projects above the cover and seals the housing gas-tight.
Claim 2
Independent Claim 116 words
A method of gas-tight sealing of a semiconductor component in a cup-shaped metal housing which functions as an electric lead for a semiconductor system housed therein and which has an upper rim and an upper open portion covered by a cover of insulating material in pressure-contact with the housing, the semiconductor system having another electric lead passing through the cover of the housing, said method comprising heating the housing; and placing a substantially annular tablet of homogenous synthetic material on the upper rim of the housing whereby the tablet melts due to the preheating of the housing and fuses to fill the part of the housing which projects above the cover and seals the housing gas-tight.
Claim 3
Dependent Claim 18 words
A method of gas-tight sealing as claimed in claim 1, further comprising regulating the cooling of the housing.
Claim 4
Dependent Claim 17 words
A method of gas-tight sealing as claimed in claim 1, wherein the tablet comprises an epoxide resin.
Claim 5
Dependent Claim 38 words
A method of gas-tight sealing as claimed in claim 1, further comprising coating the upper area of the housing up to the cover with a varnish which improves the adherence of the melted synthetic material to the housing.
Claim 6
Dependent Claim 26 words
A method of gas-tight sealing as claimed in claim 1, further comprising hardening the melted synthetic material by heating the housing at 150*C for 1 hour.

References Cited (Backward Citations)

US3474302A Cited
US3585715A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-02-20 1976-08-21 1977-02-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-02-20 1980-08-21 1981-02-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-02-20 1984-08-21 1985-02-20 $7700.00 Window Closed / Lapsed

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