Method of sealing semi-conductor assemblies
Abstract
Abstract A METHOD OF SEALING A SEMI-CONDUCTOR ASSEMBLY OF THE KIND INCLUDING A CUP-SHAPED HOUSING, A SEMI-CONDUCTOR DEVICE WITHIN THE HOUSING, A CLOSURE MEMBER CLOSING THE HOUSING, A METAL SLEEVE EXTENDING FROM SAID CLOSURE MEMBER, AND A LEAD ELECTRICALLY CONNECTED AT ONE END TO SAID SEMI-CONDUCTOR DEVICE AND EXTENDING FROM THE HOUSING WITHIN THE SLEEVE, COMPRISES THE STEPS OF FLATTENING A PART OF THE SLEEVE REMOTE FROM THE HOUSING SO THAT THE WIRE LEAD IS ALSO FLATTENED. THE FLATTENED PART OF THE SLEEVE IS THEN SUBJECT TO PRESSURE WHILE AN ELECTRIC CURRENT IS PASSED THERETHROUGH, THE ELECTRIC CURRENT CAUSING THE PORTION OF THE LEAD WITHIN THE FLATTENED PART OF THE SLEEVE TO BECOME WELDED TO THE SLEEVE, AND THEREBY FORM A SEAL WITHIN THE SLEEVE BETWEEN THE INTERIOR OF THE HOUSING AND ATMOSPHERE.
Inventors
- 👤 Brian Bedford
Bibliographic Details
Claims Analysis
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1974-06-21 | 1974-12-21 | 1975-06-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-06-21 | 1978-12-21 | 1979-06-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-06-21 | 1982-12-21 | 1983-06-22 | $7700.00 | Window Closed / Lapsed |