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US3715245A Expired / Lapsed US ⏱️ 0.0 years remaining

Selective liquid phase epitaxial growth process

Assignee: General Electric Co
•
Filing: 1971-02-17
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Granted: 1973-02-06
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Expires: 1991-02-17
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Abstract

Abstract A process for selectively growing semiconductor material, particularly Group III-V semiconductor compounds, on semiinsulating substrates with uniform dissolution and regrowth in selected regions is disclosed. The fabrication of substantially planar monolithic semiconductor devices in a semi-insulating substrate and, in particular, light-emitting devices are also disclosed.

Inventors

  • 👤 S Galginaitis
  • 👤 A Barnett

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 19:38
CPC Classifications
C; C30; C30B; C30B19/00; C30B19/06; C30B19/062; C30B19/10; C30B19/12; Y; Y10; Y10S; Y10S148/00; Y10S148/006; Y10S148/026; Y10S148/05; Y10S148/065; Y10S148/106; Y10S148/107

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 252 words
A process comprising the steps of preparing a saturated solution of gallium phosphide material in gallium including a conductivity modifying impurity of one type, preparing a substrate of semi-insulating gallium phosphide material having a first plurality of parallel masking stripes to provide a first plurality of parallel unmasked regions, immersing said substrate into said solution, increasing the temperature of sAid solution by a few degrees above said given temperature to cause dissolution of at least a portion of said substrate, lowering the temperature of said solution below said given temperature whereby said gallium phosphide material is epitaxially deposited on said unmasked regions of said substrate to form stripes of gallium phosphide of said one conductivity type therein, removing said substrate from said solution, forming a planar surface in said substrate including said stripes of one conductivity type separated by stripes of semi-insulating material, forming a second plurality of parallel masking stripes on said planar surface disposed to intersect said stripes of said one conductivity type to provide a second plurality of parallel unmasked regions thereon, preparing another saturated solution of gallium phosphide material in gallium including a conductivity modifying impurity of opposite type, immersing said substrate into said other solution, lowering the temperature of said other saturated solution whereby said gallium phosphide material is epitaxially deposited on said unmasked regions of said substrate to form stripes of gallium phosphide of said opposite conductivity type thereon thereby producing P-N junctions at the intersection of said one-type conductivity stripes with said opposite-type conductivity stripes.
Claim 2
Dependent Claim 252 words
A process comprising the steps of preparing a saturated solution of gallium phosphide material in gallium including a conductivity modifying impurity of one type, preparing a substrate of semi-insulating gallium phosphide material having a first plurality of parallel masking stripes to provide a first plurality of parallel unmasked regions, immersing said substrate into said solution, increasing the temperature of sAid solution by a few degrees above said given temperature to cause dissolution of at least a portion of said substrate, lowering the temperature of said solution below said given temperature whereby said gallium phosphide material is epitaxially deposited on said unmasked regions of said substrate to form stripes of gallium phosphide of said one conductivity type therein, removing said substrate from said solution, forming a planar surface in said substrate including said stripes of one conductivity type separated by stripes of semi-insulating material, forming a second plurality of parallel masking stripes on said planar surface disposed to intersect said stripes of said one conductivity type to provide a second plurality of parallel unmasked regions thereon, preparing another saturated solution of gallium phosphide material in gallium including a conductivity modifying impurity of opposite type, immersing said substrate into said other solution, lowering the temperature of said other saturated solution whereby said gallium phosphide material is epitaxially deposited on said unmasked regions of said substrate to form stripes of gallium phosphide of said opposite conductivity type thereon thereby producing P-N junctions at the intersection of said one-type conductivity stripes with said opposite-type conductivity stripes.
Claim 3
Dependent Claim 26 words
The process of claim 1 in which said conductivity modifying impurity of one type is P-type and said conductivity modifying impurity of opposite type is N-type.
Claim 4
Dependent Claim 26 words
The process of claim 1 in which said conductivity modifying impurity of one type is N-type and said conductivity modifying impurity of opposite type is P-type.

References Cited (Backward Citations)

US2561411A Cited
US3171762A Cited
GB1149109A Cited
US3585087A Cited
US3535772A Cited
US3619304A Cited
US3611069A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1976-02-06 1976-08-07 1977-02-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1980-02-06 1980-08-07 1981-02-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1984-02-06 1984-08-07 1985-02-06 $7700.00 Window Closed / Lapsed

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