Activation process for electroless nickel plating
Abstract
Abstract A SILICON SURFACE IS PREPARED FOR ELECTROLESS NICKEL PLATING BY ACTIVATION WITH AN AQUEOUS HYDROFLUORIC ACID SOLUTION CONTAINING FROM ONE E TO ONE HUNDRED P.P.M. OF IONIC GOLD. SUBSEQUENT ELECTROLESS DEPOSITION OF NICKEL PROCEEDS MORE UNIFORMLY OVER THE ENTIRE SILICON SURFACE, AND RESULTS IN A MORE STABLE, TIGHTLY ADHERING NICKEL PLATE DUE TO THE IMPROVED ACTIVATION STEP. ADDITIONAL STABILITY AND EVEN MORE RELIABLE ADHESION IS OBTAINED BY A SUBSEQUENT SINTERING OF THE COMPOSITE STRUCTURE ABOVE THE GOLD-SILICON EUTECTIC TEMPERATURE TO ALLOY THE GOLD ACTIVATION FILM WITH THE SILICON. THE SINTERING STEP ISS THEN PREFERABLY FOLLOWED BY A SECOND ELECTROLESS NICKEL PLATING STEP TO BUILD A NICKEL CONTACT AREA OF INCREASED THICKNESS.
Inventors
- 👤 H Hentzschel
Bibliographic Details
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