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US3703668A
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US
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Semiconductor device with semiconductor elements arranged side by side and provided with hollow cooling bodies
Assignee: ABB Norden Holding AB
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Filing: 1971-07-09
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Granted: 1972-11-21
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Expires: 1991-07-09
Abstract
Abstract A semiconductor device comprises semiconductor elements arranged side by side and provided with hollow cooling bodies. The cooling bodies are joined to each other by a connection conduit for the coolant which is flexible and which insulates the cooling bodies from each other electrically. The connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.
Inventors
- 👤 Per-Ake Bylund
- 👤 Tibor Farkas
- 👤 Nils Eric Andersson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 16:12
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W90/00
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
72 words
Semiconductor device comprising semiconductor elements arranged side by side which are provided with hollow cooling bodies through which a coolant flows, a connection conduit for coolant joining the cooling bodies to each other, said connection conduit being flexible and insulating the cooling bodies from each other electrically, in which the connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.
Claim 2
Dependent Claim
72 words
Semiconductor device comprising semiconductor elements arranged side by side which are provided with hollow cooling bodies through which a coolant flows, a connection conduit for coolant joining the cooling bodies to each other, said connection conduit being flexible and insulating the cooling bodies from each other electrically, in which the connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.
Claim 3
Dependent Claim
72 words
Semiconductor device comprising semiconductor elements arranged side by side which are provided with hollow cooling bodies through which a coolant flows, a connection conduit for coolant joining the cooling bodies to each other, said connection conduit being flexible and insulating the cooling bodies from each other electrically, in which the connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.
Claim 4
Dependent Claim
72 words
Semiconductor device comprising semiconductor elements arranged side by side which are provided with hollow cooling bodies through which a coolant flows, a connection conduit for coolant joining the cooling bodies to each other, said connection conduit being flexible and insulating the cooling bodies from each other electrically, in which the connection conduit comprises a tube of insulating inorganic material and a bellows of metallic material fixed to each end of the tube.
Claim 5
Dependent Claim
20 words
Semiconductor device according to claim 1, in which the bellows is bent in the direction of transport of the coolant.
References Cited (Backward Citations)
US2780757A
Cited
US2917685A
Cited
GB1076237A
Cited
US3502956A
Cited
US3586959A
Cited
DE1917285A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-11-21 | 1976-05-22 | 1976-11-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-11-21 | 1980-05-22 | 1980-11-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-11-21 | 1984-05-22 | 1984-11-21 | $7700.00 | Window Closed / Lapsed |