Method of making composite nickel electroplate and electrolytes therefor
Abstract
Abstract A COMPOSITE NICKEL-CONTAINING ELECTROPLATE IS FORMED ON A BASE METAL SURFACE BY ELECTROPLATING ON THE SURFACE AN ADHERENT NICKEL OR NICKEL ALLOY LAYER HAVING A THICKNESS OF FROM ABOUT 0.15 TO 1.5 MILS AND AN AVERAGE SULFUR CONTENT OF LESS THAN ABOUT 0.03%. AN INTERMEDIATE NICKEL OR NICKEL ALLOY LAYER, HAVING A THICKNESS OF FROM ABOUT 0.005 TO 0.2 MILS AND AN AVERAGE SULFUR CONTENT OF FROM ABOUT 0.05 TO 0.3% IS THEN ELECTROPLATED ON THE LOWER LAYER, AN ADHERENT UPPER NICKEL OR NICKEL ALLOY LAYER HAVING A THICKNESS OF FROM ABOUT 0.2 TO 1.5 MILS AND AVERAGE SULFUR CONTENT OF FROM ABOUT 0.02 TO 0.15% IS THEN ELECTROPLATED ON THE INTERMEDIATE LAYER, THE UPPER LAYER CONTAINING A LOWER PERCENTAGE OF SULFUR THEN THE LOWER LAYER. THE SOURCE OF SULFUR, FOR AT LEAST THE INTERMEDIATE LAYER, IS PROVIDED BY INCLUDING NOVEL THIOSULFONATED OF NITRILES OF AMIDES IN THE PLATING BATH FOR THE LAYER.
Inventors
- 👤 Richard J Clauss
- 👤 Robert Tremmel
- 👤 Donald H Becking
Bibliographic Details
Claims Analysis
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