Thermal display module

Claim 2

A thermal display module to be used in cooperation with thermally sensitive material for recording a form of information representation thereupon, said module comprising: a. a supporting substrate having an elongated major face thereof, b. a thermal display head body comprising first and second areas of semiconductor material, said body having two oppositely disposed principal faces thereof and being mounted to the elongated major face of said supporting substrate at one of said two principal faces, c. an array of heater elements disposed within said first area, select ones of said heater elements, when energized, defining said form of information representation, said heater elements extending to the other principal face of said body and being substantially thermally isolated from one another along said other principal face; a matrix of drive networks disposed within said second area selectively coupled with said heater elements, d. a circuit module for selectively actuating said drive networks disposed upon the said major face of said supporting substrate at a location spaced from said body, said circuit module including a plurality of input terminals and a plurality of output terminals, e. a first metallization pattern disposed upon said major face of said supporting substrate providing a plurality of interconnections between said output terminals of said circuit module and said matrix of drive networks, f. a second metallization pattern disposed upon said major face of said supporting substrate providing a plurality of interconnections to said plurality of input terminals of said circuit module, and g. conductive means disposed solely at the interface of the elongated major face of said supporting substrate and said one principal face of said body for selectively interconnecting said matrix with said array, said conductive means further including bonding pads at said interface for directly contacting portions of said first metallization pattern adjacent said body and providing support for the mounting of said body to said supporting substrate.

Claim 3

The module as described in claim 1 including heat dissipative components respectively associated with each of said heater elements; said conductive means disposed between said one principal face of said body and the major face of said substrate having portions of which selectively interconnect the matrix of drive networks with said heat dissipative components; discrete thickened regions of said conductive means on said one principal face providing said pads and being respectively connected with said plurality of interconnections provided by said first metallization pattern.

Claim 4

The module as described in claim 1 wherein the number of output terminals of said circuit module exceed the input terminals therEof.

Claim 5

The module as described in claim 3 wherein the second metallization pattern extends to an edge of said elongated major face and includes expanded end portions at the said edge.

Claim 6

The module as described in claim 4 wherein said supporting substrate has a thickness thereof, the length and width dimensions of said major face being substantially greater than the said thickness.

Claim 7

A thermal display module to be used in cooperation with thermally sensitive material for recording a form of information representation thereupon, said module comprising: a. a supporting substrate having an elongated major face thereof, b. a thermal display-head body comprising first and second areas of semiconductor material, said body having two oppositely disposed principal faces thereof and being mounted to the elongated major face of said supporting substrate at one of the said two principal faces, c. an array of heater elements disposed within said first area, select ones of said heater elements, when energized, defining said form of information representation, said heater elements extending to the other principal face of said body and being substantially thermally isolated from one another along said other principal face; a matrix of drive networks disposed within said second area selectively coupled with said heater elements for energizing said heater elements, d. a circuit module, for selectively actuating said drive networks, disposed upon the said major face of said supporting substrate at a location spaced from said body, said circuit module including a plurality of input terminals and a plurality of output terminals, the number of said output terminals exceeding the number of the said input terminals, e. a first metallization pattern disposed upon said major face of said supporting substrate providing a plurality of interconnections between said output terminals of said circuit module and said matrix of drive networks, f. a second metallization pattern disposed upon said major face of said supporting substrate and extending to an edge of said elongated major face, and further including expanded end portions at said edge, said second metallization pattern providing a plurality of interconnections to said plurality of said input terminals of said circuit module, and g. protective wear-resistant material disposed over said first and second metallization patterns.

Claim 8

A thermal display module to be used in cooperation with thermally sensitive material for recording a form of information representation thereupon, said module comprising: a. a supporting substrate having an elongated major face thereof, b. a thermal display-head body comprising first and second areas of semiconductor material, said body having two oppositely disposed principal faces thereof and being mounted to the elongated major face of said supporting substrate at one of the said two principal faces, c. an array of heater elements disposed within said first area, select ones of said heater elements, when energized, defining said form of information representation, said heater elements extending to the other principal face of said body and being substantially thermally isolated from one another along said other principal face; a matrix of drive networks disposed within said second area selectively coupled with said heater elements for energizing said heater elements, d. a circuit module, for selectively actuating said drive networks, disposed upon the said major face of said supporting substrate at a location spaced from said body, said circuit module including a plurality of input terminals and a plurality of output terminals, the number of said output terminals exceeding the number of the said input terminals, e. a first metallization pattern disposed upon said major face of said supporting substrate providing a plurality of interconnections between said output terminals of said circuit module and said matrix of drive networks, f. a second metallization pattern disposed upon said major face of said supporting substrate and extending to an edge of said elongated major face, and further including expanded end portions at said edge, said second metallization pattern providing a plurality of interconnections to said plurality of said input terminals of said circuit module, and g. protective wear-resistant material disposed over said first and second metallization patterns.

Claim 9

A thermal printing module of the type to be utilized in conjunction with thermally sensitive record material for recording a form of information representation on said record material, said module comprising: a. a supporting substrate of electrically insulating material, said supporting substrate having a principal surface thereof, b. a print-head body having two major oppositely disposed faces thereof, said print-head body being mounted to said principal surface of said supporting substrate at one of said two major faces, c. said print-head body further including a first region of semiconductor material having an array of heater elements provided by discrete portions of said semiconductor material which are physically separated along the other major face of said print body, select ones of said heater elements, when energized, defining said form of information representation, said elements having heat dissipative means respectively disposed therein at said one major face, d. said print-head body further comprising a second region of semiconductor material having a matrix of thermal drive networks disposed therein at said one major face for energizing said heater elements, e. an insulating layer of material at said one major face adherent to, and integrally joining, said first and second semiconductor regions, f. conductive means having major portions thereof adjacent and adherent to said insulating layer for selectively electrically interconnecting said matrix of thermal drive networks with said heat dissipative means of said array through apertures in said insulating layer, said conductive means further including bonding pad portions which extend out over said insulating layer, said bonding pad means disposed solely at the interface of said one major face and the principal surface of said supporting substrate, g. means for providing electrical signals to said matrix, said means comprising a metallization pattern disposed solely upon and adherent to the said principal surface of the supporting substrate, the metallization pattern extending from a location immediately adjacent said print-head body to a location remote from said print-head body, the portion of said metallization pattern adjacent said print-head body directly contacting said bonding pad means at said adjacent location, said bonding pad means providing auxiliary support for the mounting of said print-head body to said supporting substrate.

Claim 10

A thermal printing module of the type to be utilized in conjunction with thermally sensitive record material for recording a form of information representation on said record material, said module comprising: a. a supporting substrate of electrically insulating material, said supporting substrate having a principal surface thereof, b. a print-head body having two major oppositely disposed faces thereof, said print-head body being mounted to said principal surface of said supporting substrate at one of said two major faces, c. said print-head body further including a first region of semiconductor material having an array of heater elements provided by discrete portions of said semiconductor material which are physically separated along the other major face of said print body, select ones of said heater elements, when energized, defining said form of information representation, said elements having heat dissipative means respectively disposed therein at said one major face, d. said print-head body further comprising a second region of semiconductor material having a matrix of thermal drive networks disposed therein at said one major face for energizing said heater elements, e. an insulating layer of material at said one major face adherent to, and integrally joining, said first and second semiconductor regions, f. conductive means having major portions thereof adjacent and adherent to said insulating layer for selectively electrically interconnecting said matrix of thermal drive networks with said heat dissipative means of said array through apertures in said insulating layer, said conductive means further including bonding pad portions which extend out over said insulating layer, said bonding pad means disposed solely at the interface of said one major face and the principal surface of said supporting substrate, g. means for providing electrical signals to said matrix, said means comprising a metallization pattern disposed solely upon and adherent to the said principal surface of the supporting substrate, the metallization pattern extending from a location immediately adjacent said print-head body to a location remote from said print-head body, the portion of said metallization pattern adjacent said print-head body directly contacting said bonding pad means at said adjacent location, said bonding pad means providing auxiliary support for the mounting of said print-head body to said supporting substrate.

Claim 11

The apparatus as described in claim 7 further including protective wear resistant material disposed over said bonding pad means and said metallization pattern at least at the location of the direct contacting of said metallization pattern with said bonding pad means.

Claim 12

A thermal printing module of the type to be used in cooperation with thermally sensitive material for recording a form of information representation on said thermally sensitive material, said thermal printing module comprising: a supporting substrate of substantially electrically insulating material, a print-head body having two major faces thereof, said print-head body being secured to a principal surface of said supporting substrate at one of said two major faces, said print-head body comprising first and second areas of semiconductor material, an array of heater elements disposed within said first area, select ones of said heater elements, when energized, defining said form of information representation, said heater elements extending to the other major face of said print body and being substantially thermally isolated from one another along said other major face, a matrix of thermal drive networks for energizing said select ones of said heater elements, said matrix being disposed within said second area at said one major face, conductive means disposed at the interface of said one major face and said principal surface of said supporting substrate for selectively electrically interconnecting said matrix with heat dissipative means formed in said array of heater elements, said conductive means further including bonding pad portions which are adherent to, and extend out adjacent to, the periphery of said second area, means for providing electrical signals to said matrix comprising a metallization pattern disposed upon and adherent to the said principal surface of said supporting substrate, the metallization pattern intersecting and directly contacting the said bonding pad portions at said adjacent locations, said metallization pattern extending to locations remote from said adjacent locations, and protective wear-resistant material disposed over said bonding pad portions and said metallization pattern at least at the location of said intersection.

Claim 13

A thermal printing module of the type to be used in cooperation with thermally sensitive material for recording a form of information representation on said thermally sensitive material, said thermal printing module comprising: a supporting substrate of substantially electrically insulating material, a print-head body having two major faces thereof, said print-head body being secured to a principal surface of said supporting substrate at one of said two major faces, said print-head body comprising first and second areas of semiconductor material, an array of heater elements disposed within said first area, select ones of said heater elements, when energized, defining said form of information representation, said heater elements extending to the other major face of said print body and being substantially thermally isolated from one another along said other major face, a matrix of thermal drive networks for energizing said select ones of said heater elements, said matrix being disposed within said second area at said one major face, conductive means disposed at the interface of said one major face and said principal surface of said supporting substrate for selectively electrically interconnecting said matrix with heat dissipative means formed in said array of heater elements, said conductive means further including bonding pad portions which are adherent to, and extend out adjacent to, the periphery of said second area, means for providing electrical signals to said matrix comprising a metallization pattern disposed upon and adherent to the said principal surface of said supporting substrate, the metallization pattern intersecting and directly contacting the said bonding pad portions at said adjacent locations, said metallization pattern extending to locations remote from said adjacent locations, and protective wear-resistant material disposed over said bonding pad portions and said metallization pattern at least at the location of said intersection.

Claim 14

The apparatus as described in claim 9 further including adhesive material between said one major face of said body and said principal surface of said substrate.

Claim 15

The apparatus as described in claim 9 wherein the second area of said body surrounds the first area on at least three sides.

Claim 16

The apparatus as described in claim 9 wherein said heater elements are trapezoidal shaped.

Claim 17

In information display apparatus of the type including record material for recording thereon a form of information representation and means operatively associated with said record material for generating said form of information representation, the improvement wherein said information generating means comprises a supporting substrate having a principal surface; a first semiconductor portion having two major faces thereof and including an array of opEratively distinct regions of semiconductor material having respective circuit components disposed within said discrete regions at one of said two major faces and having surface portions extending to the other major face, select ones of said components, when actuated, energizing select ones of said operatively distinct regions, thereby to define said form of information representation; a second semiconductor portion disposed adjacent said first semiconductor portion, a matrix of drive networks for selectively actuating said circuit components, said matrix being disposed at one major face of said second semiconductor portion, said first and second semiconductor portions being secured to the principal surface of said supporting substrate at their respective one major faces; conductive means disposed intermediate said supporting substrate principal surface and said one major face of said first and second semiconductor portions for selectively electrically interconnecting said matrix with said components; means for supplying electrical signals to said matrix with said components; means for supplying electrical signals to said matrix, said means including a metallization pattern disposed upon and adherent to the said principal surface of the supporting substrate, the metallization pattern extending from a location immediately adjacent said second semiconductor portion to a location remote from said second semiconductor portion; and bonding pad means disposed solely at the interface of said second semiconductor portion and said principal surface of said supporting substrate electrically interconnected with said matrix and directly contacting said metallization pattern adjacent said second semiconductor portion, said bonding pad means providing support for the mounting of said second semiconductor portion to said supporting substrate.

Claim 18

In information display apparatus of the type including record material for recording thereon a form of information representation and means operatively associated with said record material for generating said form of information representation, the improvement wherein said information generating means comprises a supporting substrate having a principal surface; a first semiconductor portion having two major faces thereof and including an array of opEratively distinct regions of semiconductor material having respective circuit components disposed within said discrete regions at one of said two major faces and having surface portions extending to the other major face, select ones of said components, when actuated, energizing select ones of said operatively distinct regions, thereby to define said form of information representation; a second semiconductor portion disposed adjacent said first semiconductor portion, a matrix of drive networks for selectively actuating said circuit components, said matrix being disposed at one major face of said second semiconductor portion, said first and second semiconductor portions being secured to the principal surface of said supporting substrate at their respective one major faces; conductive means disposed intermediate said supporting substrate principal surface and said one major face of said first and second semiconductor portions for selectively electrically interconnecting said matrix with said components; means for supplying electrical signals to said matrix with said components; means for supplying electrical signals to said matrix, said means including a metallization pattern disposed upon and adherent to the said principal surface of the supporting substrate, the metallization pattern extending from a location immediately adjacent said second semiconductor portion to a location remote from said second semiconductor portion; and bonding pad means disposed solely at the interface of said second semiconductor portion and said principal surface of said supporting substrate electrically interconnected with said matrix and directly contacting said metallization pattern adjacent said second semiconductor portion, said bonding pad means providing support for the mounting of said second semiconductor portion to said supporting substrate.