US3689985A
Expired / Lapsed
US
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Method of making a semiconductor unit
Assignee: Robert Bosch GmbH
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Filing: 1971-07-15
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Granted: 1972-09-12
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Expires: 1991-07-15
Abstract
Abstract A method of making a semiconductor element. A first semiconductor body has a pair of first major surfaces on opposite sides. A first contact is provided on and covers one of the first surfaces. A socket plate is conductively connected to the other of the first surfaces and has a first contact pin. A second semiconductor body has a pair of second major surfaces and a second contact provided on and covering one of these second major surfaces. A carrier is connected with the socket plate and the second semiconductor body and located between the two. A second contact pin is provided on the second body at a side thereof facing away from the carrier and a third contact pin is provided, both the second and third contact pins penetrating the socket in insulated relationship. A connecting wire has a straight first end portion conductively secured to the second contact pin, a helically convoluted second portion conductively secured to the third contact pin, and a center portion with respect to which each of the end portions extends at an angle. An additional contact pin is provided on the first semiconductor body at a side thereof facing away from the socket plate and is in direct electrically conductive engagement with the carrier.
Inventors
- 👤 Johannes Nier
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:22
CPC Classifications
H; H02; H02J; H02J7/00; H02J7/70; H10; H10P; H10P95/00; H10W; H10W72/00; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/132; H10W72/50; H10W72/541; H10W72/547; H10W72/5473; H10W72/851; H10W72/874; H10W72/884; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49826; Y10T29/49895; Y10T29/49899
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
251 words
A method of assembling a semiconductor unit, comprising the steps of providing a holding device composed of a set of three assembly templates stackable and vertically guidable with reference to one another and provided with recesses for respective components of at least one semiconductor unit; providing a first and a second semiconductor body, a socket plate, a plurality of contacts, contact pins and a connecting wire; connecting a pair of contact pins in insulated relationship with said socket plate; inserting said contact pins of said socket plate into corresponding apertures of a first template of said set; placing a second template onto said first template; disposing in a recess of said second template of said set said first semiconductor body, and in an other recess said carrier; placing a third template onto said second template; disposing in a recess of said third template said second semiconductor body, and in at least one other recess said connecting wire while simultaneously pushing a helically convoluted second end portion thereof onto one of said pair of contact pins and along the same until it is skew with reference thereto and clampingly engages said one contact pin and is under pretension; slipping an annulus of solder material onto said pair and an additional contact pin; removing said second and third templates from said first template; and placing said first template and the components carried thereby into a soldering oven for a requisite period of time to thereby effect soldering of said components to one another.
Claim 2
Independent Claim
251 words
A method of assembling a semiconductor unit, comprising the steps of providing a holding device composed of a set of three assembly templates stackable and vertically guidable with reference to one another and provided with recesses for respective components of at least one semiconductor unit; providing a first and a second semiconductor body, a socket plate, a plurality of contacts, contact pins and a connecting wire; connecting a pair of contact pins in insulated relationship with said socket plate; inserting said contact pins of said socket plate into corresponding apertures of a first template of said set; placing a second template onto said first template; disposing in a recess of said second template of said set said first semiconductor body, and in an other recess said carrier; placing a third template onto said second template; disposing in a recess of said third template said second semiconductor body, and in at least one other recess said connecting wire while simultaneously pushing a helically convoluted second end portion thereof onto one of said pair of contact pins and along the same until it is skew with reference thereto and clampingly engages said one contact pin and is under pretension; slipping an annulus of solder material onto said pair and an additional contact pin; removing said second and third templates from said first template; and placing said first template and the components carried thereby into a soldering oven for a requisite period of time to thereby effect soldering of said components to one another.
Claim 3
Dependent Claim
63 words
A method as defined in claim 1, said connecting wire having a first and a helically convoluted second end portion, and wherein the length of said first and helically convoluted second end portions are so related that the desired pretension of said connecting zone is obtained when said second end portion is pushed along said one contact pin to the maximum extent possible.
Claim 4
Dependent Claim
35 words
A method as defined in claim 1, said soldering oven being of the pass-through type and being filled with an atmosphere of N2 90 H2 10, and said unit being heated therein to 375* C.
Claim 5
Dependent Claim
117 words
A method as defined in claim 2, further comprising the step of placing an annulus of solder material onto said one contact pin atop said second end portion of said connecting wire; and placing an additional connecting wire into said other recess of said third template with a helically convoluted additional second end portion of said additional connecting wire surrounding said one contact pin but facing in opposite axial direction from said second end portion of the first-mentioned connecting wire, and pushing said additional second end portion along said one contact pin towards said annulus until said additional second end portion is skew with reference to said one contact pin and said additional connecting wire is pretensioned.
Claim 6
Dependent Claim
32 words
A method as defined in claim 1, wherein the step of placing said first template and components into a soldering oven comprises passing them through a soldering oven of the pass-through type.
Claim 7
Dependent Claim
34 words
A method as defined in claim 1, wherein tHe step of placing said first template and components into a soldering oven comprises heating them in said oven to a temperature of substantially 375* C.
Claim 8
Dependent Claim
14 words
A method as defined in claim 1, wherein said steps are carried out consecutively.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-09-12 | 1976-03-13 | 1976-09-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-09-12 | 1980-03-13 | 1980-09-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-09-12 | 1984-03-13 | 1984-09-12 | $7700.00 | Window Closed / Lapsed |