Patent US3687345A successfully refreshed from Google Patents.
US3687345A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for aligning and breaking wafers
Assignee: Signetics Corp
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Filing: 1970-11-23
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Granted: 1972-08-29
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Expires: 1990-11-23
Abstract
Abstract A method and apparatus for aligning and breaking scribed semiconductor wafers in which a scribed wafer is accurately aligned and mounted on a frame assembly having locating holes. The frame assembly with the wafer attached thereto is then placed on a breaking platform of a wafer breaker having generally perpendicular first and second breaking ridges and having locating pins which cooperate with the frame assembly locating holes for positioning the frame assembly in alignment with the breaking ridges. Pressure is applied to the frame assembly and wafer for holding them against the breaking platforms. The breaking platform is then translated to cause the wafer to pass over the first and second breaking ridges for breaking the wafer into a plurality of semiconductor chips generally along perpendicular scribe lines on the wafer.
Inventors
- 👤 Heinz F Carlson
- 👤 George L Issac
- 👤 Graham H Mosely
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 15:39
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0428; B; B28; B28D; B28D5/00; B28D5/0005; Y; Y10; Y10T; Y10T225/00; Y10T225/10; Y10T225/12; Y10T225/30; Y10T225/307; Y10T225/321; Y10T225/325; Y10T225/329; Y10T29/00; Y10T29/49; Y10T29/49789; Y10T29/4979
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
211 words
Apparatus for breaking a semiconductor wafer of the type having a plurality of first and second scribe lines which are perpendicular to each other and which define a plurality of semiconductor chips comprising a breaking platform having first, second and third surfaces, said second surface intersecting said first surface intersecting said first surface at an angle to define a first breaking ridge, said second surface intersecting said third surface at an angle to define a second breaking ridge, said second breaking ridge being generally perpendicular to said first breaking ridge, holding means for yieldably holding a semiconductor wafer against said breaking platform with the first and second scribe lines of the wafer respectively aligned generally parallel to said first and second breaking ridges, first means for causing relative translational movement parallel to said second breaking ridge between the wafer and the breaking platform to relatively move the wafer from said first surface over said first breaking ridge and onto said second surface and second means for causing relative translational movement between the wafer and said breaking platform parallel to said first breaking ridge to relatively move the wafer over said second breaking ridge and on to said third surface whereby the wafer is broken along the first and second scribe lines.
Claim 2
Dependent Claim
211 words
Apparatus for breaking a semiconductor wafer of the type having a plurality of first and second scribe lines which are perpendicular to each other and which define a plurality of semiconductor chips comprising a breaking platform having first, second and third surfaces, said second surface intersecting said first surface intersecting said first surface at an angle to define a first breaking ridge, said second surface intersecting said third surface at an angle to define a second breaking ridge, said second breaking ridge being generally perpendicular to said first breaking ridge, holding means for yieldably holding a semiconductor wafer against said breaking platform with the first and second scribe lines of the wafer respectively aligned generally parallel to said first and second breaking ridges, first means for causing relative translational movement parallel to said second breaking ridge between the wafer and the breaking platform to relatively move the wafer from said first surface over said first breaking ridge and onto said second surface and second means for causing relative translational movement between the wafer and said breaking platform parallel to said first breaking ridge to relatively move the wafer over said second breaking ridge and on to said third surface whereby the wafer is broken along the first and second scribe lines.
Claim 3
Dependent Claim
55 words
Apparatus in accordance with claim 1 wherein said holding means comprises a diaphragm having a holding surface, a pressure source, and means for connecting said diaphragm to said pressure source whereby a pressure is developed within said diaphragm and said holding surface exerts pressure on the wafer to hold it firmly against said breaking platform.
Claim 4
Dependent Claim
137 words
Apparatus in accordance with claim 1 wherein one of said first and second means for causing translational movement comprises a base having first guides, a first platform support slidably mounted on said first guides, a first shaft threadedly engaging said first frame, first motor means for rotating said first shaft whereby said first frame is translated along said first guides, and wherein the other of said first and second means for causing translational movement comprises second guides carried by said first frame generally at right angles to said first guides, a second platform support slidably mounted on said second guides, said breaking platform mounted on said second platform support, a second shaft threadedly engaging said second platform support and second motor means for rotating said second shaft whereby said second frame is translated along said second guides.
Claim 5
Dependent Claim
26 words
Apparatus in accordance with claim 2 wherein said pressure source is adjustable so that the pressure exerted by said holding surface on the wafer is adjustable.
Claim 6
Dependent Claim
265 words
Apparatus for aligning and breaking a semiconductor wafer of the type having a plurality of first and second scribe lines which are perpendicular to each other and which define a plurality of semiconductor chips comprising a frame assembly having locating means and an adhesive surface holding a semiconductor wafer on said frame assembly and maintaining the first and second scribe lines in a predetermined alignment with respect to said locating means, a breaking platform having first, second and third surfaces, said second surface intersecting said first surface at an angle to define a first breaking ridge, said second surface intersecting said third surface at an angle to define a second breaking ridge, said second breaking ridge being generally perpendicular to said first breaking ridge, holding means for yieldably holding said frame assembly and wafer against said breaking platform, said holding means having positioning means which cooperate with said locating means of said frame assembly so that the wafer is oriented with the first and second scribe lines of the Wafer aligned parallel to said first and second breaking ridges, respectively, first means for causing relative translational movement parallel to said second breaking ridge between the wafer and the breaking platform to move the wafer from said first surface over said first breaking ridge and onto said second surface and second means for causing relative translational movement between the wafer and the breaking platform parallel to said first breaking ridge whereby said wafer passes over said second breaking ridge and onto said third surface whereby the wafer is broken along the first and second scribe lines.
Claim 7
Dependent Claim
265 words
Apparatus for aligning and breaking a semiconductor wafer of the type having a plurality of first and second scribe lines which are perpendicular to each other and which define a plurality of semiconductor chips comprising a frame assembly having locating means and an adhesive surface holding a semiconductor wafer on said frame assembly and maintaining the first and second scribe lines in a predetermined alignment with respect to said locating means, a breaking platform having first, second and third surfaces, said second surface intersecting said first surface at an angle to define a first breaking ridge, said second surface intersecting said third surface at an angle to define a second breaking ridge, said second breaking ridge being generally perpendicular to said first breaking ridge, holding means for yieldably holding said frame assembly and wafer against said breaking platform, said holding means having positioning means which cooperate with said locating means of said frame assembly so that the wafer is oriented with the first and second scribe lines of the Wafer aligned parallel to said first and second breaking ridges, respectively, first means for causing relative translational movement parallel to said second breaking ridge between the wafer and the breaking platform to move the wafer from said first surface over said first breaking ridge and onto said second surface and second means for causing relative translational movement between the wafer and the breaking platform parallel to said first breaking ridge whereby said wafer passes over said second breaking ridge and onto said third surface whereby the wafer is broken along the first and second scribe lines.
Claim 8
Dependent Claim
57 words
Apparatus in accordance with claim 5 wherein said holding means includes a diaphragm having a holding surface, a pressure source and means for connecting said diaphragm to said pressure source whereby a pressure is developed within said diaphragm and said holding surface exerts pressure on the wafer holder and wafer to hold them against said breaking platform.
Claim 9
Dependent Claim
133 words
Apparatus in accordance with claim 5 wherein one of said first and second means for causing translational movement comprises a base having first guides, a first platform support slidably mounted on said first guides, a first shaft threadedly engaging said first platform support, first motor means for rotating said first shaft whereby said first platform support is translated along said first guides and wherein the other of said first and second means for causing relative translational movement comprises second guides carried by said first platform support generally at right angles to said first guides, a second platform support slidably mounted on said second guides, a second shaft threadedly engaging said second platform support and second motor means for rotating said second shaft whereby said second platform support is translated along said second guides.
Claim 10
Dependent Claim
27 words
Apparatus in accordance with claim 6 wherein said pressure source is adjustable for adjusting the pressure exerted by said holding surface on the wafer holder and wafer.
Claim 11
Independent Claim
156 words
A method for breaking a semiconductor wafer of the type having a plurality of first and second scribe lines which are perpendicular to each other and which define a plurality of semiconductor chips comprising aligning the semiconductor wafer with first and second perpendicular breaking ridges of a breaking platform so that the first scribe lines are parallel to the first breaking ridge and the second scribe lines are parallel to the second breaking ridge, yieldably urging the aligned wafer against the breaking platform, relatively translating the breaking platform with respect to the wafer in a direction parallel to the second breaking ridge so that the wafer passes over the first breaking ridge and is broken along the first scribe lines and relatively translating the breaking platform with respect to the wafer in a direction parallel to the first breaking ridge over the second breaking ridge so that the wafer is broken along the second scribe lines.
Claim 12
Independent Claim
156 words
A method for breaking a semiconductor wafer of the type having a plurality of first and second scribe lines which are perpendicular to each other and which define a plurality of semiconductor chips comprising aligning the semiconductor wafer with first and second perpendicular breaking ridges of a breaking platform so that the first scribe lines are parallel to the first breaking ridge and the second scribe lines are parallel to the second breaking ridge, yieldably urging the aligned wafer against the breaking platform, relatively translating the breaking platform with respect to the wafer in a direction parallel to the second breaking ridge so that the wafer passes over the first breaking ridge and is broken along the first scribe lines and relatively translating the breaking platform with respect to the wafer in a direction parallel to the first breaking ridge over the second breaking ridge so that the wafer is broken along the second scribe lines.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-08-29 | 1976-02-28 | 1976-08-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-08-29 | 1980-02-28 | 1980-08-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-08-29 | 1984-02-28 | 1984-08-29 | $7700.00 | Window Closed / Lapsed |