Improved separation of the deposition mandrel from a vapor phase deposited semiconductor body
Abstract
Abstract An at least unilaterally open, hollow body of semiconductor material, such as a tubular or cup-shaped body for example, is produced by precipitating the semiconductor material from a gaseous phase upon a heatable carrier consisting of a different material whose thermal coefficient of expansion is greater than that of the semiconductor material. During the process the carrier is heated to a temperature at which the difference in thermal expansion causes fissures or cracks to appear in the precipitated semiconductor material. Thereafter the precipitation of semiconductor material is continued until the cracks are closed by the further growth of precipitating semiconductor material. Ultimately the carrier is removed by pulling or dropping it out of the resulting cooled semiconductor body.
Inventors
- 👤 Wolfgang Dietze
Bibliographic Details
Claims Analysis
Total Claims: 2References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-08-22 | 1976-02-21 | 1976-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-08-22 | 1980-02-21 | 1980-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-08-22 | 1984-02-21 | 1984-08-22 | $7700.00 | Window Closed / Lapsed |