Patent US3678385A successfully refreshed from Google Patents.
US3678385A
Expired / Lapsed
US
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Assembly and test device for microelectronic circuit members
Assignee: TE Connectivity Corp
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Filing: 1969-09-26
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Granted: 1972-07-18
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Expires: 1989-09-26
Abstract
Abstract An assembly and test device for microelectronic circuit members has a circuit-holding member provided with an area in which a microelectronic circuit member is disposed and grooves are in communication with the area. A lead frame-holding member has an opening in which the circuit-holding member is positioned and it has grooves for receiving leads of a lead frame, these grooves being disposed in alignment with the grooves of the circuitholding member when the holding members are latchably secured together. A pressure-applying member is latchably secured onto the lead frame-holding member and it is provided with ribs that are mateable with the aligned grooves of the circuit-holding and lead frame-holding members so that ends of the leads are held in engagement with terminals of the microelectronic member in order that the ends of the leads can be soldered or welded onto the terminals, the ribs also hold the leads in engagement with electrical connectors of the lead frame-holding member. The lead frame-holding member with the circuit-holding member and the pressure-applying member in position thereon after the leads have been connected to the terminals on the microelectronic member and the leads have been severed from the lead frame is connected as an assembly onto a test board with electrical connectors thereon mated with the electrical connectors of the lead frame-holding member to test the electrical connections between the leads and the terminals and the operation of the microelectronic member over a predetermined time.
Inventors
- 👤 Peter Martin Bruner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:31
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; Y; Y10; Y10S; Y10S439/00; Y10S439/912; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
390 words
An assembly and testing device for a microelectronic circuit member, comprising: a circuit member holder having a projecting rim, a recess defined by said rim for removably receiving a microelectronic circuit member below the surface of said rim, a plurality of grooves in said rim and in alignment with respective circuit paths on said microelectronic circuit member for receiving respective leads of a lead frame member in registration in said grooves and in registration with the respective circuit paths of said microelectronic circuit member, a lead frame holding-member freely and removably receiving said circuit member holder for supporting said lead frame above the level of said microelectronic circuit member, a plurality of grooves in said lead frame holding-member in alignment with respective grooves of said circuit member holder for receiving the respective leads of said electrically in contact with respective circuit paths of said microelectronic circuit member, a removable pressure-applying member overlying said lead frame Holding-member and provided with a plurality of ribs received respectively in said grooves of said lead frame holding-member in order to register against and apply pressure upon the respective leads of said lead frame, a plurality of electrical sockets contained in said lead frame holding-member, said sockets having their axes entering parallel to each other and normally of said grooves in said lead frame holding-member, each of said sockets having a contact tab extending into one of said grooves in said lead frame holding-member, and said lead frame holding-member and said pressure-applying member having aligned openings therein overlying said microelectronic circuit member for exposing the circuit paths of said microelectronic circuit member whereby upon locating a microelectronic circuit member on said recess in said circuit member holder, positioning a lead frame on said lead frame holding-member with the leads thereof disposed in said grooves in said lead frame holding-member, and upon assembling said lead frame holding-member to said circuit member holder and assembling said pressure applying member to said lead frame holding-member, said leads of said lead frame are effectively connected to said contact tabs of said sockets and said leads are connected to terminals of said circuit member, and said circuit member can be tested by plugging said lead frame holder to test terminals of a testing apparatus and said circuit member can thereafter be encapsulated by introducing potting material into said aligned openings.
Claim 2
Dependent Claim
390 words
An assembly and testing device for a microelectronic circuit member, comprising: a circuit member holder having a projecting rim, a recess defined by said rim for removably receiving a microelectronic circuit member below the surface of said rim, a plurality of grooves in said rim and in alignment with respective circuit paths on said microelectronic circuit member for receiving respective leads of a lead frame member in registration in said grooves and in registration with the respective circuit paths of said microelectronic circuit member, a lead frame holding-member freely and removably receiving said circuit member holder for supporting said lead frame above the level of said microelectronic circuit member, a plurality of grooves in said lead frame holding-member in alignment with respective grooves of said circuit member holder for receiving the respective leads of said electrically in contact with respective circuit paths of said microelectronic circuit member, a removable pressure-applying member overlying said lead frame Holding-member and provided with a plurality of ribs received respectively in said grooves of said lead frame holding-member in order to register against and apply pressure upon the respective leads of said lead frame, a plurality of electrical sockets contained in said lead frame holding-member, said sockets having their axes entering parallel to each other and normally of said grooves in said lead frame holding-member, each of said sockets having a contact tab extending into one of said grooves in said lead frame holding-member, and said lead frame holding-member and said pressure-applying member having aligned openings therein overlying said microelectronic circuit member for exposing the circuit paths of said microelectronic circuit member whereby upon locating a microelectronic circuit member on said recess in said circuit member holder, positioning a lead frame on said lead frame holding-member with the leads thereof disposed in said grooves in said lead frame holding-member, and upon assembling said lead frame holding-member to said circuit member holder and assembling said pressure applying member to said lead frame holding-member, said leads of said lead frame are effectively connected to said contact tabs of said sockets and said leads are connected to terminals of said circuit member, and said circuit member can be tested by plugging said lead frame holder to test terminals of a testing apparatus and said circuit member can thereafter be encapsulated by introducing potting material into said aligned openings.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-07-18 | 1976-01-17 | 1976-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-07-18 | 1980-01-17 | 1980-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-07-18 | 1984-01-17 | 1984-07-18 | $7700.00 | Window Closed / Lapsed |