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US3676745A Expired / Lapsed US ⏱️ 0.0 years remaining

Electronic assembly utilizing thermal panel for heat sink

Assignee: Individual
•
Filing: 1970-09-04
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Granted: 1972-07-11
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Expires: 1990-09-04
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Abstract

Abstract An improved heat sink for dissipation of heat in an electronic assembly is provided. The assembly includes a printed circuit board on which components including various heat developing components are mounted. The heat developing components are contained or encapsulated in respective blocks which are positioned to dissipate heat to an associated mounting panel.

Inventors

  • 👤 John C Traweek

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 20:50
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20509

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 107 words
An assembly for electronic components utilizing thermal dissipating means as a heat sink comprising, in combination, printed circuit board means, thermally conductive blocks containing heat generating electronic components, bolt and washer means electrically connecting said components to said board means, said bolt and washer means physically affixing said blocks to said board means and said washer means being interposed between the blocks and said board means to minimize the transfer of heat from said blocks to said board means, a thermal dissipating panel providing a heat sink, and said blocks positioned to abut said panel to maximize the transfer of heat from said block to said panel.
Claim 2
Dependent Claim 107 words
An assembly for electronic components utilizing thermal dissipating means as a heat sink comprising, in combination, printed circuit board means, thermally conductive blocks containing heat generating electronic components, bolt and washer means electrically connecting said components to said board means, said bolt and washer means physically affixing said blocks to said board means and said washer means being interposed between the blocks and said board means to minimize the transfer of heat from said blocks to said board means, a thermal dissipating panel providing a heat sink, and said blocks positioned to abut said panel to maximize the transfer of heat from said block to said panel.

References Cited (Backward Citations)

US3201655A Cited
DE1201435B Cited
US3518493A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1975-07-11 1976-01-10 1976-07-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1979-07-11 1980-01-10 1980-07-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1983-07-11 1984-01-10 1984-07-11 $7700.00 Window Closed / Lapsed

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