US3676745A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic assembly utilizing thermal panel for heat sink
Assignee: Individual
•
Filing: 1970-09-04
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Granted: 1972-07-11
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Expires: 1990-09-04
Abstract
Abstract An improved heat sink for dissipation of heat in an electronic assembly is provided. The assembly includes a printed circuit board on which components including various heat developing components are mounted. The heat developing components are contained or encapsulated in respective blocks which are positioned to dissipate heat to an associated mounting panel.
Inventors
- 👤 John C Traweek
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 03:10
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20509
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
107 words
An assembly for electronic components utilizing thermal dissipating means as a heat sink comprising, in combination, printed circuit board means, thermally conductive blocks containing heat generating electronic components, bolt and washer means electrically connecting said components to said board means, said bolt and washer means physically affixing said blocks to said board means and said washer means being interposed between the blocks and said board means to minimize the transfer of heat from said blocks to said board means, a thermal dissipating panel providing a heat sink, and said blocks positioned to abut said panel to maximize the transfer of heat from said block to said panel.
Claim 2
Dependent Claim
107 words
An assembly for electronic components utilizing thermal dissipating means as a heat sink comprising, in combination, printed circuit board means, thermally conductive blocks containing heat generating electronic components, bolt and washer means electrically connecting said components to said board means, said bolt and washer means physically affixing said blocks to said board means and said washer means being interposed between the blocks and said board means to minimize the transfer of heat from said blocks to said board means, a thermal dissipating panel providing a heat sink, and said blocks positioned to abut said panel to maximize the transfer of heat from said block to said panel.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-07-11 | 1976-01-10 | 1976-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-07-11 | 1980-01-10 | 1980-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-07-11 | 1984-01-10 | 1984-07-11 | $7700.00 | Window Closed / Lapsed |